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Adhesive pouring device of LED (light emitting diode) lamp

A technology of LED lights and glue filling, which is applied to the device and coating of the surface coating liquid, which can solve the problems of low degree of automation, affecting production efficiency, and poor continuity, and achieve strong continuity and structure Simplicity and the effect of improving work productivity

Inactive Publication Date: 2018-07-24
成都众鑫聚合科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the glue filling process of existing LED production, operators are often required to take and discharge materials, which is time-consuming and laborious, the continuity is not strong, the degree of automation is not high, and the glue filling process takes too long, which affects the efficiency of production

Method used

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  • Adhesive pouring device of LED (light emitting diode) lamp
  • Adhesive pouring device of LED (light emitting diode) lamp

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Embodiment Construction

[0015] The technical solution of the present invention will be further described in detail below in conjunction with specific examples, but the protection scope of the present invention is not limited to the following description.

[0016] like Figure 1-2 As shown, a glue filling device for LED lamps includes a frame 1, and the two ends of the side frame of the frame 1 are equipped with a drive shaft 3 with a sprocket 2, and the sprocket 2 is provided with two The chains 5 are parallel to each other, the transmission shaft at one end is provided with a transmission gear 4 connected with the power mechanism, and the frame 1 is sequentially provided with a preheating zone 6 and a glue filling zone from one end of the transmission gear 4 7 and curing area 8, the lamp fixing base 9 is uniformly arranged on the chain 5.

[0017] Further, the glue filling area 7 includes a support base 701 and a glue filling tank 702, the glue filling tank 702 is fixedly arranged above the support...

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Abstract

The invention relates to an adhesive pouring device of an LED (light emitting diode) lamp. The adhesive pouring device comprises a machine frame, wherein a transmission shaft with a chain wheel is arranged at both ends of side frames of the machine frame; two parallel chains are arranged on the chain wheel; a transmission gear is arranged at the transmission shaft at one end and is connected witha power mechanism; the part, starting from one end of the transmission gear, of the machine frame is sequentially provided with a preheating area, an adhesive pouring area and a curing area; lamp positioning devices are uniformly arranged on each chain; the adhesive pouring area comprises a support base and an adhesive pouring tank, and a metering valve and a liquid level sensor are arranged on the adhesive pouring tank. The adhesive pouring device has the advantages that the structure is simple, the continuity is strong, the automation degree is high, and the production efficiency is effectively improved.

Description

technical field [0001] The invention relates to the technical field of LED lighting production, in particular to a glue filling device for LED lights. Background technique [0002] In the production process of LED lights, it is necessary to fill the LED chip with glue to make the LED have better durability and reliability. The glue filling process is to put the LED molding cavity into the oven for preheating, and then pour the Liquid glue is injected into the forming model, and then put into the oven to let the liquid glue solidify, and the LED falls out of the mold cavity. [0003] In the glue filling process of existing LED production, operators are often required to take and unload materials, which is time-consuming and laborious, the continuity is not strong, the degree of automation is not high, and the glue filling process takes too long, which affects the efficiency of production. Contents of the invention [0004] The object of the present invention is to overcome...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C11/10
CPCB05C11/10B05C11/101B05C11/1026
Inventor 周磊王建英周松阳范泽英王长江
Owner 成都众鑫聚合科技有限公司
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