3D packaging based on 3D offset printed memory

Abstract

The invention provides 3D packaging (3D<2>-oP) based on a 3D offset printed memory (3D-oP). Data mask graphs in different 3D-oP chips are merged to the same data mask. In a different printing step, the offset amount of the wafer relative to the data mask is different. Thus, the data graphs from the same data mask are printed to data entry membranes of different 3D-oP chips.

Description

technical field [0001] This invention relates to the field of integrated circuit memories and, more particularly, to mask-programmed read-only memories (mask-ROMs). Background technique [0002] Three-dimensional mask-programmed read-only memory (3D-MPROM) is an ideal medium for mass publishing. US Patent 5,835,396 discloses a 3D-MPROM. Such as figure 1 As shown, 3D-MPROM is a monolithic integrated circuit, which includes a semiconductor substrate 0 and a three-dimensional stack 10 stacked on the substrate. The three-dimensional stack 10 contains M (M≥2) storage layers (such as 10A, 10B) stacked on each other. Each storage layer (such as 10A) contains multiple top address lines (such as 2a), bottom address lines (such as 1a) and storage elements (such as 5aa). Each storage element stores n (n≥1) bits of data. The storage layer (such as 16A, 16B) is coupled with the substrate 0 through contact via holes (such as 1av, 1'av). The substrate circuit 0X in the substrate 0 co...

AI Technical Summary

Problems solved by technology

At the 22nm node, the cost of a data mask is $250,000, and the cost of a set of x8x2 3D-MPROM data masks (including 16 data masks) is as high as $4 million

Such a high data mask cost will greatly limit the wide application of 3D-MPROM

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