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CMOS sensor packaging structure and packaging method thereof

A CMOS sensor and packaging structure technology, applied in the field of CMOS sensor packaging structure and its packaging, can solve the problems of high packaging manufacturing cost, poor packaging sealing, etc., achieve low packaging manufacturing cost, good packaging sealing, reduce equipment and energy consumption cost effect

Pending Publication Date: 2018-04-24
PIONEER MATERIALS INC CHENGDU
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, the technical problems of traditional CMOS sensors are: high packaging manufacturing cost, poor packaging sealing

Method used

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  • CMOS sensor packaging structure and packaging method thereof
  • CMOS sensor packaging structure and packaging method thereof

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Embodiment Construction

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. In addition, those that do not indicate specific conditions in the examples are carried out according to conventional conditions or conditions suggested by the manufacturer. The reagents or instruments used were not indicated by the manufacturer, and they were all conventional products that could be purchased from the market.

[0030] Accordingly, the following detailed des...

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Abstract

The invention relates to a CMOS sensor packaging structure and a packaging method thereof, and mainly relates to the technical field of image sensors. According to the CMOS sensor packaging method, the image sensing area of a CMOS image sensor wafer is firstly attached to a light-transmitting plate, so that a high-dust-free manufacturing environment is not required during the subsequent packagingprocess of a CMOS sensor. Therefore, the equipment cost and the energy consumption cost in the packaging process are greatly reduced. In addition, not only an ultra-thin CMOS sensor packaging structure finally manufactured through the CMOS sensor packaging method has the advantages of a thin structure, but also the packaging structure is good in package sealing performance and low in package manufacturing cost. As a result, the cost of enterprises is reduced, and the productivity of enterprises is improved. The maximization of profits is achieved. Therefore, the CMOS sensor packaging structureand the packaging method thereof are applied to the technical field of image sensors and have important popularization and application values.

Description

technical field [0001] The present invention relates to the technical field of image sensors, in particular to a CMOS sensor packaging structure and a packaging method thereof. Background technique [0002] CMOS (abbreviation of Complementary Metal-Oxide Semiconductor, Chinese means complementary metal oxide semiconductor) sensor is a kind of image sensor and is generally the core component of a digital camera. [0003] At present, the technical problems of traditional CMOS sensors are: high manufacturing cost of packaging and poor sealing of packaging. Contents of the invention [0004] The purpose of the present invention is to provide a CMOS sensor packaging method, which has low requirements on the packaging environment and can significantly reduce the cost of the packaging process. [0005] Another object of the present invention is to provide a CMOS sensor packaging structure, which has better sealing performance, and is manufactured by the above-mentioned CMOS sens...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146
CPCH01L27/14601H01L27/14618H01L27/14625H01L27/14683
Inventor 吴振兴林刘毓刘健群刘浩哲翁良志黃乾燿程子桓吴绍懋
Owner PIONEER MATERIALS INC CHENGDU
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