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Photoelectric sensing device and electronic equipment

A photoelectric sensing and photosensitive pixel technology, applied in the field of photoelectric sensing, can solve problems such as inability to obtain clear images, and achieve the effects of reducing thickness, reducing cost, and improving sensing accuracy

Active Publication Date: 2018-04-24
柳州梓博科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the above-mentioned optical fingerprint identification module cannot obtain a clear image and still needs to be improved

Method used

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  • Photoelectric sensing device and electronic equipment
  • Photoelectric sensing device and electronic equipment
  • Photoelectric sensing device and electronic equipment

Examples

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Embodiment Construction

[0039] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0040] In the description of the present invention, it should be understood that the terms "first" and "second" are used for description purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined. "Contact" or "touchin...

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Abstract

The invention discloses a photoelectric sensing device and electronic equipment. The photoelectric sensing device comprises a semiconductor substrate, wherein the semiconductor substrate comprises a first surface and a second surface opposite to the first surface; a plurality of light sensitive pixels are formed on the first surface of the semiconductor substrate; a plurality of through holes which pass through the semiconductor substrate toward the first surface are formed on the second surface of the semiconductor substrate; and the through holes correspond to the light sensitive pixels. Theelectronic equipment comprises the photoelectric sensing device.

Description

technical field [0001] The invention relates to the field of photoelectric sensing, in particular to a photoelectric sensing device and electronic equipment. Background technique [0002] At present, biometric information sensors, especially fingerprint recognition sensors, have gradually become standard components of electronic products such as mobile terminals. Since the optical fingerprint recognition sensor has a stronger penetration capability than the capacitive fingerprint recognition sensor, an optical fingerprint recognition module applied to a mobile terminal has been proposed. Such as figure 1 As shown, the optical fingerprint identification module includes an optical fingerprint sensor 400 and a light source 402 . Wherein, the optical fingerprint sensor 400 is disposed under the protective cover 401 of the mobile terminal. The light source 402 is disposed adjacent to one side of the optical fingerprint identification sensor 400 . When the user's finger F touc...

Claims

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Application Information

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IPC IPC(8): G06K9/00H04M1/02G06F1/16
CPCH04M1/026G06F1/1684G06V40/1324G06V40/1318
Inventor 李问杰
Owner 柳州梓博科技有限公司
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