A cooling device for a data center cabinet

Abstract

The invention provides a data center cabinet cooling device which includes a high-temperature heat exchanger adhering to a cabinet back plate and a low-temperature heat exchanger arranged at the top of a cabinet, wherein the high-temperature heat exchanger is connected with a first cooling tower, to utilize cooling liquid at a first temperature to cool air leaving from the cabinet to a third temperature; and the low-temperature heat exchanger is connected with a second cooling tower through a refrigerator, to utilize cooling liquid at a second temperature to cool air at the third temperature to a fourth temperature. The first temperature is higher than the second temperature, and the third temperature is higher than the fourth temperature. In the data center cabinet cooling device, by arrangement of the high-temperature heat exchanger at the back of the cabinet and the low-temperature heat exchanger at the top of the cabinet, graded cooling can be achieved, the heat dissipation capability is enhanced, and the power consumption of a machine room air conditioning system is reduced.

Description

technical field [0001] The invention relates to the field of cooling systems, and in particular to a cooling device for a data center cabinet. Background technique [0002] With the rise of cloud computing, more and more data centers are being built, with the following trends: the power consumption of a single cabinet is increasing; the rise of high-temperature servers; and the requirements for energy saving are getting higher and higher. [0003] The increasing power consumption of a single cabinet forces the end of the air conditioner to be closer to the IT equipment, from the initial room-level cooling (water-cooled precision air conditioners, air-cooled precision air conditioners, etc.) to unit-level cooling (water-cooled inter-row air conditioners, air-cooled row room air conditioners, overhead coil refrigeration units, etc.), and then to rack-level cooling (water-cooled backplanes, heat pipe backplanes, etc.). The cooling energy efficiency and heat exchange capacity o...

AI Technical Summary

Problems solved by technology

The disadvantage of the solution using water as the internal fluid is that there is a risk of water entering the server, and the device is prone to uneven cooling; the disadvantage of the solution using fluorinated liquid as the internal fluid is that it is technically difficult and uneven distribution can easily cause air blockage; The second type of liquid cooling scheme is direct immersion, which can be divided into single-phase solution and phase change solution

However, the solution of single-phase solution brings out a lot of liquid during maintenance; while the solution of phase change solution has high initial investment and is inconvenient to maintain

Generally speaking, liquid cooling solutions have the disadvantage of high cost

[0007] In summary, there is currently a lack of a cooling device that has sufficient heat dissipation capacity and saves energy

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