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Ultrasonic fingerprint identification module group, device and electronic equipment

A fingerprint identification module and fingerprint identification module technology, applied in piezoelectric device/electrostrictive device, character and pattern recognition, acquisition/organization of fingerprints/palmprint, etc. Complex structure and other problems, to achieve high resolution, high integration, good piezoelectric effect

Inactive Publication Date: 2018-03-13
成都大超科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current mainstream fingerprint recognition technologies include optical fingerprint recognition, capacitive fingerprint recognition and ultrasonic fingerprint recognition, but they also have their own shortcomings, such as optical fingerprint recognition and capacitive fingerprint recognition. Unable to analyze fingerprint images; and ultrasonic fingerprint recognition does not have such high requirements for the application environment, so ultrasonic fingerprint recognition is widely used
[0003] However, the structures of the existing ultrasonic fingerprint recognition modules are very complicated and the integration degree is low.

Method used

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  • Ultrasonic fingerprint identification module group, device and electronic equipment
  • Ultrasonic fingerprint identification module group, device and electronic equipment
  • Ultrasonic fingerprint identification module group, device and electronic equipment

Examples

Experimental program
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no. 1 example

[0025] Please refer to figure 1 , the first embodiment of the present invention provides an ultrasonic fingerprint identification device 10, the ultrasonic fingerprint identification device 10 includes an ultrasonic fingerprint identification module 10a, an adhesive layer 14 and a display module 16, wherein the display module 16 One surface is a touch surface 165 for the user to operate, and the other surface opposite to the touch surface 165 is provided with an adhesive layer 14, and the adhesive layer 14 is bonded to the ultrasonic fingerprint identification module 10a to strengthen the ultrasonic fingerprint identification module 10a The connection strength with the display module 16. The display module 16 can be some existing display modules in the market including basic structures such as display layer and cover glass, but preferably a display module including OLED (Organic Light Emitting Diode) or TFT (Thin Film Transistor). The display module 16 includes a fingerprint ...

no. 2 example

[0039] Please refer to image 3 , the second embodiment of the present invention also provides an ultrasonic fingerprint recognition device 20 of another structure, the ultrasonic fingerprint recognition device 20 includes an ultrasonic fingerprint recognition module 20a, a display module 26 and an adhesive layer 24, the display module One of the surfaces of the group 26 is a touch surface 265 for the user to operate, and the other surface opposite to the touch surface 265 is provided with an adhesive layer 24, and the adhesive layer 24 is bonded with the ultrasonic fingerprint identification module 20a to enhance the ultrasonic fingerprint identification. The connection strength between the identification module 20a and the display module 26 is identified. The display module 26 can be some existing display modules in the market including basic structures such as display layer and cover glass, but preferably a display module including OLED (Organic Light Emitting Diode) or TFT...

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PUM

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Abstract

The invention relates to the technical field of fingerprint identifications, and in particular to an ultrasonic fingerprint identification module group, an ultrasonic fingerprint identification deviceand electronic equipment. The ultrasonic fingerprint identification module group is disposed at an opposite side of one side of a display module for displaying; the ultrasonic fingerprint identification module group includes ultrasonic fingerprint identification modules and a non-conductive substrate; the ultrasonic fingerprint identification modules are stacked on the surface, which is close toa display module, of the non-conductive substrate; each ultrasonic fingerprint identification module includes an upper electrode layer, a piezoelectric layer and a lower electrode layer which are disposed in lamination; the upper electrode layer and the lower electrode layer are respectively disposed on two opposite surfaces of the piezoelectric layer; and the lower electrode layer is close to thenon-conductive substrate. The ultrasonic fingerprint identification module group, the ultrasonic fingerprint identification device and the electronic equipment have the advantages of simple structure, high integration level and thin thickness.

Description

【Technical field】 [0001] The invention relates to the technical field of fingerprint identification, in particular to an ultrasonic fingerprint identification module, device and electronic equipment. 【Background technique】 [0002] At present, fingerprint recognition technology has been widely used in many fields such as mobile terminals, smart homes, and crime fighting. It brings a lot of convenience and safety to people's life. The current mainstream fingerprint recognition technologies include optical fingerprint recognition, capacitive fingerprint recognition and ultrasonic fingerprint recognition, but they also have their own shortcomings, such as optical fingerprint recognition and capacitive fingerprint recognition. Fingerprint images cannot be resolved; and ultrasonic fingerprint recognition does not have such high requirements for the application environment, so ultrasonic fingerprint recognition is widely used. [0003] However, the structures of the existing ult...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00H01L41/08H01L41/193H10N30/00H10N30/857
CPCG06V40/1306H10N30/857H10N30/704
Inventor 吴露向勇王开安高奇文
Owner 成都大超科技有限公司
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