Automatic drying oven used for production of printed circuit board assembly

Abstract

The invention discloses an automatic drying oven used for production of a printed circuit board assembly. The automatic drying oven comprises a bottom plate; a supporting plate is arranged in the middle part of the front end of the bottom plate; a PLC controller is arranged on the upper surface of the supporting plate; the input end of the PLC controller is electrically connected with the output end of an external power supply; four bearing pedestals are arranged on the upper surface of the bottom plate; a driving roller is arranged between two bearing pedestals in a sleeving manner while a driven roller is arranged between the other two bearing pedestals in a sleeving manner; the outer surface of the driving roller and the outer surface of the driven roller are sleeved with a conveyor belt; a fixed base is arranged on the left side of the front end of the bottom plate; a motor is arranged on the upper surface of the fixed base; the input end of the motor is electrically connected withthe output end of the PLC controller; and the motor output shaft is connected with the driving roller through a coupling. The automatic drying oven used for production of the printed circuit board assembly is simple in structure, convenient to use, movable to be butt jointed with other equipment conveniently, and capable of accurately controlling the heating temperature, giving out an alarm whenthe temperature is overhigh, realizing automatic start and stop, and saving energy.

Description

technical field [0001] The invention relates to the technical field of printed circuit board assembly production, in particular to an automatic oven for the production of printed circuit board assemblies. Background technique [0002] When the circuit board is printed and produced, it is necessary to install circuit modules on it, such as chips, which need to be pasted with solder paste, and then the circuit board is heated according to a specific reflow temperature curve to melt the solder paste, and its alloy components are cooled and solidified. The metallurgical connection is achieved by forming solder joints between the device and the printed circuit board. Apply solder paste on the circuit board, paste chips or other components and place it in an oven for heating, so that the solder paste is melted and welded. The existing automatic oven for the production of printed circuit board components is not easy to control the temperature. During the heating process, the heati...

AI Technical Summary

Problems solved by technology

Apply solder paste on the circuit board, paste chips or other components and place it in an oven for heating, so that the solder paste is melted and welded. The existing automatic oven for the production of printed circuit board components is not easy to control the temperature. During the heating process, the heating temperature cannot be directly displayed, and there is no temperature alarm function. If the temperature is too high, the circuit board will be easily damaged. In addition, when there is no circuit board on the conveying mechanism, the heating device cannot be turned off in time, resulting in waste of resources.

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