Electronic equipment, housing assembly, and circuit board assembly

A technology for circuit board components and electronic equipment, applied in the direction of cooling/ventilation/heating transformation, can solve the problem of limited heat dissipation area, achieve good heat dissipation performance, large heat dissipation area, and solve the effect of heat dissipation

Inactive Publication Date: 2017-12-29
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiments of the present invention can solve the problem of limited heat dissipation area when shielding covers are used to dissipate heat from electronic equipment with plastic casings

Method used

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  • Electronic equipment, housing assembly, and circuit board assembly
  • Electronic equipment, housing assembly, and circuit board assembly
  • Electronic equipment, housing assembly, and circuit board assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] See figure 1 , the present embodiment provides a casing assembly for electronic equipment, which includes a plastic casing 1, the inner side of the plastic casing 1 is covered with a metal layer 2, and a graphite part is pasted on the metal layer 2 by thermally conductive glue or other thermally conductive materials 3.

[0027] In this embodiment, the metal layer 2 is a metal paint layer, which is coated on the inner surface of the plastic shell 1 . In addition to pasting the above-mentioned graphite component 3 on the metal layer 2 with thermally conductive adhesive, the graphite component 3 can also be fixedly connected to the metal layer 2 through various fixing methods, and the specific fixing method is not limited.

[0028] The shell assembly of this embodiment is assembled on the electronic equipment, and the graphite part 3 on it can be in contact with the heating element 4 in the electronic equipment (see also image 3 ), so that the heat on the heating elemen...

Embodiment 2

[0035] See Figure 6 , this embodiment provides an electronic device. The difference between this embodiment and Embodiment 1 is that the contact between the graphite component 3 and the thermally conductive adhesive 7 of this embodiment is a concave-convex structure nested with each other, thereby increasing the The contact area between the two speeds up the speed of heat transfer and improves the heat dissipation efficiency. Moreover, the connection through the nested concave-convex structure can prevent the graphite part 3 from moving with the thermally conductive adhesive 7, which is beneficial to ensure the close contact between the two, and at the same time, it is also conducive to the positioning of the two during assembly, thereby improving the assembly process. efficiency.

Embodiment 3

[0037] See Figure 7 This embodiment provides an electronic device. The difference from Embodiment 1 is that the through hole 61 of the shielding cover 6 of this embodiment is opened on the side wall, and the thermally conductive adhesive 7 is pasted on the side of the heating element 4 . The position of the thermally conductive adhesive 7 corresponds to the position of the through hole 61 , so that the thermally conductive adhesive 7 can pass through the through hole 61 . The position of the graphite component 3 also corresponds to the position of the thermal conductive glue 7 , and the graphite component 3 extends in the direction of the thermal conductive glue 7 , so that the thermal conductive glue 7 can be aligned with the graphite component 3 and fully contacted.

[0038] Compared with Embodiments 1 and 2, the graphite component 3 of this embodiment is not stacked together with the thermally conductive adhesive 7 , which is beneficial to make the electronic device thinne...

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Abstract

The invention is suitable for the technical field of electronic equipment, and provides electronic equipment, a housing assembly, and a circuit board assembly. The housing assembly comprises a plastic housing, and the circuit board assembly comprises a substrate which is provided with a heating element. The substrate is disposed in the plastic housing, and the inner side surface of the plastic housing is covered by a metal layer. A graphite part is fixed on the metal layer, and the heating element is fixedly provided with heat-conducting glue. The graphite part makes contact with the heat-conducting glue. When the electronic equipment is assembled, the heat-conducting glue makes contact with the graphite part, and the heat on the heating element is transferred to the heat-conducting glue. The heat-conducting glue can achieve the quick transfer of heat to the graphite part. The graphite part has the good performances of heat conduction and heat dissipation, and the heat on the graphite part can be transferred to the metal layer. The metal layer covers the plastic housing, is larger in area, and facilitates the quick dissipation of heat. Compared with a mode of dissipating the heat of the heating element through a shielding cover, the electronic equipment is larger in heat dissipation area, is high in speed of heat dissipation, and is good in performance of heat dissipation.

Description

technical field [0001] The invention belongs to the technical field of electronic equipment, and in particular relates to an electronic equipment, a shell assembly and a circuit board assembly. Background technique [0002] Generally, electronic devices with plastic casings, such as smart phones with plastic casings, can't introduce the heat of the heating elements into the casing, so most of them use shielding covers to help the heating elements dissipate heat, thereby solving the pain point of heat dissipation of plastic casings. However, the heat dissipation area of ​​the shielding case is limited, the heat dissipation speed is slow, and the heat dissipation effect is not good. For this reason, it is necessary to develop a new heat dissipation structure or heat dissipation method to help the electronic equipment with a plastic casing to dissipate heat. Contents of the invention [0003] The embodiments of the present invention can solve the problem of limited heat diss...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 范艳辉
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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