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Cup device for single wafer-type cleaning equipment

A kind of cleaning equipment, single-chip technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as device operation failure

Inactive Publication Date: 2017-12-15
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If one of the lifting rods is abnormal, the entire device will fail to operate as a whole

Method used

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  • Cup device for single wafer-type cleaning equipment
  • Cup device for single wafer-type cleaning equipment

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Embodiment Construction

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0018] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, It is not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operate in a par...

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Abstract

The invention provides a cup device for single wafer-type cleaning equipment, which comprises a cup body. The cup body comprises a movable part, a fixing part and a lifting device, wherein the movable part is arranged in one part of the side surface of the cup body and moves under driving of the lifting device to enabling a wafer to be in or out of the cavity body of the cup body; the fixing part is arranged in the other part of the side surface of the cup body; and the fixing part and the movable part form a complete side surface of the cup body. The technical scheme provided by the invention can thoroughly clean the wafer, the crash frequency can be reduced, and the production efficiency of a stock is enhanced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a cup device of a single-chip cleaning equipment. Background technique [0002] With the development of the semiconductor manufacturing process, the feature size of semiconductor devices is getting smaller and smaller, and the cleaning of the semiconductor structure is more and more important. If it cannot be fully cleaned, the structure and performance of the device will be affected. During the operation of the existing cup device of cleaning equipment, the machine frequently stops due to the inconsistent operation of the lifting rod. The movement of the cup device of the existing cleaning machine is completed by the simultaneous up and down movement of a plurality of cylinder lifting rods (generally composed of 3 or more cylinder lifting rods), which is an integral movement. If one of the lifting rods is abnormal, the whole operation of the whole device will fail. SUM...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67023
Inventor 李恒甫
Owner NAT CENT FOR ADVANCED PACKAGING
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