Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and device for establishing surface-mounted bonding pad in component packaging

A component and surface mount technology, applied in the computer field, can solve the problems of reducing the efficiency of surface mount pads and consuming the time of surface mount pads.

Inactive Publication Date: 2017-11-21
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] From the above description, it can be seen that every time a surface mount pad is established, the staff needs to perform a large number of repeated operations, which consumes the time for the staff to establish the surface mount pad, thereby reducing the efficiency of establishing the surface mount pad

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for establishing surface-mounted bonding pad in component packaging
  • Method and device for establishing surface-mounted bonding pad in component packaging
  • Method and device for establishing surface-mounted bonding pad in component packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0048] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection of the present invention. scope.

[0049] Such as figure 1 As shown, the embodiment of the present invention provides a method for establishing a surface mount pad in a component package, including:

[0050] Step 101: pre-loading a pre-set source program file;

[0051] Step 102: run the source program file;

[0052] Step 103: Using the source program file to execute: acquire the param...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method and a device for establishing a surface-mounted bonding pad in component packaging. A preset source program file is loaded in advance. The method comprises the following steps that: operating the source program file; utilizing the source program file to execute the steps that: obtaining an externally input parameter of the surface-mounted bonding pad; according to the parameter, determining configuration information required for establishing the surface-mounted bonding pad; and according to the configuration information, generating the packaging file of the surface-mounted bonding pad. By use of the scheme, surface-mounted bonding pad establishing efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a method and a device for establishing surface mount pads in component packaging. Background technique [0002] The surface mount pad is a connection medium for printed circuit boards to solder electronic components. It combines electronic components and circuits according to design requirements, so that circuit functions can be realized. [0003] At present, when creating a surface mount pad in a component package, the staff needs to manually input the added layer of the surface mount pad, and then manually input the same unit, precision and size value for each layer of the surface mount pad. configuration information. Every time a surface mount pad is established, the staff needs to perform a large number of repeated operations. [0004] It can be seen from the above description that every time a surface mount pad is created, the staff needs to perform a large number of rep...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/39
Inventor 张敏
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com