Thin client based on Feiteng processor

A thin client and processor technology, applied in the direction of electrical digital data processing, digital processing power distribution, digital data processing components, etc., can solve the problems of unable to meet the heat dissipation requirements of products, information security cannot be guaranteed, etc., to achieve good Heat dissipation effect, no heat dissipation dead zone, super heat dissipation effect

Pending Publication Date: 2017-11-21
湖南长城银河科技有限公司 +1
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for products based on the x86 architecture, core technologies such as software and hardware are subject to foreign manufacturers, and information security cannot be guaranteed, making it inevitable that the occurrence of self-controlled computer products produced nationwide
However, the power consumption of a thin client based on a domestic Phytium processor is more than 35W, and the heat dissipation structure of the existing technology cannot meet the heat dissipation requirements of the product.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thin client based on Feiteng processor
  • Thin client based on Feiteng processor
  • Thin client based on Feiteng processor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments. And the features in the embodiments can be combined with each other.

[0023] The "up", "down", "left", "right" and other orientations involved in the embodiments of the present invention are all relative positions, and the reference is the orientation of the drawings on paper.

[0024] Such as Figure 1 to Figure 6 As shown, a thin client based on a Feiteng processor provided by an embodiment of the present invention includes a lower cover 1, an upper cover 2, a heat dissipation module 3, and a PCBA board 4 (PCBA: Printed Circuit Board + Assembly, that is, a PCB empty board Finished products after SMT loading and DIP plug-in). The upper cover 2 is composed of a top wall 21 , an upper side wall 22 , a lower side wall 23 an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a thin client based on a Feiteng processor, comprising a lower cover (1), an upper cover (2), a heat dissipation module (3) and a PCBA (Printed Circuit Board Assembly) board (4); the lower cover and the upper cover are combined to form a shell which is cuboid on the whole, and the heat dissipation module (3) and the PCBA board (4) are arranged in the shell; the heat dissipation module (3) comprises a first heat dissipation module (31) and a second heat dissipation module (32), wherein the first heat dissipation module (31) and the second heat dissipation module (32) both comprise a heat dissipating fan, the first heat dissipation module (31) is arranged at the upper left part of the shell and the heat dissipating fan of the first heat dissipation module (31) discharges air from the upper side wall of the shell, the second heat dissipation module (32) is arranged at the lower right part of the shell and the heat dissipating fan of the second heat dissipation module (32) discharges air from the right side wall of the shell. According to the thin client based on the Feiteng processor, dual-heat dissipation module design is adopted, an internal air flue of the shell is optimized, and heat dissipation dead zones in the shell are avoided, so that the ultrahigh heat dissipation effect of a whole machine is realized; in addition, the practical fan speed under common load can be controlled to be 40% or lower of the rated speed, and ultra silence is realized.

Description

technical field [0001] The invention belongs to the technical field of computer hardware, and in particular relates to a thin client based on a Phytium processor. Background technique [0002] The thin client (network computer) is smart in design, small in size, light and beautiful, which can save office desk space. At the same time, the network computer can be installed on the back of the monitor with the attached bracket, which is light and beautiful. Thin clients based on x86 architecture usually have low power consumption, and the power consumption of the whole machine is usually below 10W. It adopts a fanless heat dissipation design, and mainly uses the case cover heat conduction heat dissipation method, which can not only meet the heat dissipation requirements but also create a low-noise office environment. environment. However, core technologies such as software and hardware of products based on the x86 architecture are subject to foreign manufacturers, and informati...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/181G06F1/20
Inventor 龚国辉李红邓秋连李斌辉
Owner 湖南长城银河科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products