A Method for Observing and Controlling the Interface of Inkjet Printing Film and Substrate

Abstract

The invention relates to an inkjet printed film and substrate interface observation, regulation and control method. The method comprises the following steps that firstly, a printer is used for printing an electrode pattern onto a cleaned and dried substrate; secondly, an electrode inkjet printed film is subjected to the following curing process: (1) the liquid-state electrode inkjet printed film is put under a sub-zero environment and refrigerated for a period of time; and (2) the uncured refrigerated electrode inkjet printed film is subjected to curing through high-power UV curing equipment, and in the curing process, the inkjet printed film shifts; and finally, information such as the morphology and ingredients of an interface are subjected to direct observation, regulation and control by means of optics, an electron microscope and the like. The method has the advantages that (1) sample preparation is simple, operation is easy, and the consumed time is short; (2) the equipment cost requirement is low; (3) microcosmic to macrocosmic scale information of the interface can be observed; (4) the reflected information is different from that obtained through an existing testing method, the inkjet printed film and substrate interface observation, regulation and control method is a supplement to the existing testing method, and the observation result is reliable.

Description

technical field [0001] The invention relates to the field of preparation of printed electronic devices, in particular to a method for observing and regulating the interface between an inkjet printing film and a substrate. Background technique [0002] In the preparation process of electronic devices, inkjet printing technology is used for thin film deposition, which is inhomogeneous in the direction perpendicular to the interface, and the interface state between it and the underlying functional layer is much more complicated than that of vacuum deposited thin films. [0003] At present, there are but not only the following methods to explore the interface between the inkjet printing film and the bottom functional layer: (1) conduct depth analysis by XPS, SIMS and other methods, use ion etching to remove the upper inkjet printing film, and obtain the interface Composition and defect information; (2) mount the sample or directly break the sample, and observe through SEM to obt...

AI Technical Summary

Problems solved by technology

[0004] The above technology has some disadvantages: (1) The interface information obtained by XPS and SIMS is the statistical information of the selected micro-region, and it takes a long time and high cost to etch the upper film by using ion beam; (2) Mounting or breaking the sample requires Certain operating skills, SEM resolution is limited, and the interface area is often only a few nanometers, it is difficult to obtain its morphology and composition information; (3) The thickness of the thin area of ​​the sample to be tested by TEM is generally tens of nanometers, sliced, polished, ionized The thinning process takes a long time, the yield is low, and the cost of sample preparation using FIB is high; (4) Using XRR non-destructive testing, the interface information obtained is a simulation result, and its reliability is relatively low; (5) Ultrasonic microscopy The reflected information is relatively macroscopic, and its resolution scale is micron level

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