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Magneto-dielectric substrate, circuit material, and assembly having the same

A technology of dielectric polymer and magnetic medium, applied in the direction of circuit substrate materials, magnetic materials, printed circuit components, etc., can solve the problems of not being able to provide the desired bandwidth and not having the desired mechanical properties.

Active Publication Date: 2017-11-14
ROGERS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these materials are not entirely satisfactory in that they may not provide the desired bandwidth or possess the desired mechanical properties for a given application

Method used

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  • Magneto-dielectric substrate, circuit material, and assembly having the same
  • Magneto-dielectric substrate, circuit material, and assembly having the same
  • Magneto-dielectric substrate, circuit material, and assembly having the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 5

[0088] The layer comprising magnetic particles and polymer matrix was tested over the frequency range as described below.

[0089] The layer of Example 1 comprised VH magnetic particles in a thermoset polybutadiene / polyisoprene material as described above (RO4000 from Rogers Corporation with no dielectric filler or glass cloth), the layer of Example 1 in Figure 5 to Figure 8 Represented by a rhombus. The VH magnetic particles are barium cobalt Z-type hexagonal ferrite (Co 2 Z ferrite).

[0090] The layer of Example 2 comprised TT2 500 magnetic particles commercially available from Transtech in a thermoset polybutadiene / polyisoprene material as described above (RO4000 from Rogers Corporation without dielectric filler or glass cloth), The layers of Example 2 are in Figure 5 to Figure 8 Represented by a square.

[0091] The layer of Example 3 comprises SMMDP400 magnetic Co-Ba-hexagonal ferrite particles as iron coated with a layer of silicon, eg, to prevent rust, in a therm...

Embodiment approach 1

[0099] Embodiment 1: A magnetodielectric substrate comprising: a dielectric polymer matrix; and a plurality of hexagonal ferrite particles dispersed in the dielectric polymer matrix, the particles being in an amount and type effective for the magnetic dielectric The electrical base provides a magnetic constant less than or equal to 3.5, or less than or equal to 2.5, or 1 to 2 from 500 MHz to 1 GHz; and less than or equal to 0.1 from 500 MHz to 1 GHz, or 0.001 at 500 MHz to 1 GHz Magnetic loss to 0.07.

Embodiment approach 2

[0100] Embodiment 2: The magnetodielectric substrate of Embodiment 1, wherein the magnetodielectric substrate further has at least one of: a dielectric constant greater than or equal to 1.5, or 1.5 to 8 from 500 MHz to 1 GHz; at 500 MHz to 1 GHz A dielectric loss of less than 0.01 or less than 0.005; a UL94V1 rating measured at a thickness of 1.6mm; and a peel strength to copper of 3pli to 7pli measured according to IPC test method 650, 2.4.9.

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Abstract

A magneto-dielectric substrate comprises a dielectric polymer matrix and a plurality of hexaferrite particles dispersed in the dielectric polymer matrix for use in dielectric substrates having optimal magnetic and dielectric properties at frequencies greater than 500 MegaHertz (MHz) while at the same time having optimal thermomechanical and electrical properties for circuit fabrication.

Description

Background technique [0001] The present disclosure generally relates to magnetodielectric substrates useful for applications such as metal clad circuit materials for circuits, antennas, and the like. [0002] Newer design and manufacturing techniques have driven the size of electronic components such as inductors on electronic integrated circuit chips, electronic circuits, electronic packages, modules and housings, UHF, VHF and microwave antennas, for example. One approach to reducing the size of electronic components is to use magnetodielectric materials as substrates. In particular, ferrites, ferroelectrics, and multiferroics have been extensively studied as functional materials with enhanced microwave properties. However, these materials are not entirely satisfactory in that they may not provide the desired bandwidth or possess the desired mechanical properties for a given application. Developing materials with sufficient flame retardancy is particularly difficult because...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H01F1/03H01F1/34H01F17/00
CPCH01F1/0315H01F1/348H01F17/0006H05K1/0373H05K2201/086H01F1/37H01F10/005
Inventor 穆拉利·塞瑟马达范艾伦·F·霍恩三世卡尔·爱德华·施普伦托尔迈克尔·怀特
Owner ROGERS CORP
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