Substrate processing apparatus and substrate processing method

Abstract

The present invention aims to provide a substrate processing apparatus and a substrate processing method which simplifies the structure of the apparatus, reduces the installation space, reduces steps of transferring the substrate, and improves the substrate processing speed by integrally forming a load-lock unit in a process chamber. In the substrate processing apparatus (1) of the present invention to implement this, a first chamber (100) among a plurality of chambers for processing a substrate in a vacuum state integrates a front end module with a load lock portion (100a) for loading and unloading the substrate therebetween. The loading and unloading of the substrate is performed in a state where a first space (S1) of the first chamber (100), where the load lock portion (100a) is located, and a second space (S2) of the first chamber (100), which is provided below the first space (S1) and communicates with the plurality of chambers, are spatially isolated from each other.

Description

technical field [0001] The present invention relates to a substrate processing device and a substrate processing method, in particular to a substrate processing device and a substrate processing method capable of simplifying the configuration of the device, reducing the installation space, and increasing the substrate processing rate. Background technique [0002] Generally, a semiconductor is manufactured by sequentially performing a series of unit processes for forming a film, forming a pattern, forming metal wiring, and the like. The unit process is usually carried out inside the process chamber. [0003] As an example of prior art related to a substrate processing apparatus for manufacturing the above-mentioned semiconductor substrate, figure 1 A substrate processing apparatus disclosed in Korean Patent No. 10-1074083 is shown. figure 1 The substrate processing apparatus 1 shown in FIG. [0004] The loading part 10 is arranged in front of the front-end module 20 along...

AI Technical Summary

Problems solved by technology

It needs to equip a special load lock chamber 40 and a transfer chamber 50 between the front-end module 20 and the process chamber 60, so the device has the following disadvantages: the structure is complicated, the installation of the device takes up a large space, and it is difficult to install each A processing device is arranged in a predetermined space

However, if the above-mentioned load lock chamber is specially equipped, the structure of the device will be complicated and the volume will increase, so there is a problem that the substrate processing device cannot be realized compactly.

Images