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Electronic equipment and heat dissipation method therefor

A technology for electronic equipment and electronic equipment control, applied in cooling/ventilation/heating transformation, modification by conduction heat transfer, modification with gaseous coolant, etc., can solve the problem of fan noise, power consumption, passive heat dissipation of radiator Low efficiency and other problems, to achieve the effect of delaying the time of active heat dissipation, improving the conduction efficiency, and prolonging the time of conducting heat

Inactive Publication Date: 2017-09-15
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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  • Summary
  • Abstract
  • Description
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Problems solved by technology

[0003] The radiator is located inside the electronic device, and conducts heat through the bottom surface (D-cover) of the electronic device through air conduction. However, when the cooling fan is not running, the passive cooling efficiency of the radiator is low; when the cooling fan is running In some cases, it needs to consume power, and the fan will generate noise during operation. The cooling fan is the main source of noise in the electronic equipment

Method used

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  • Electronic equipment and heat dissipation method therefor
  • Electronic equipment and heat dissipation method therefor
  • Electronic equipment and heat dissipation method therefor

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Embodiment Construction

[0049] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present disclosure as recited in the appended claims.

[0050] In view of the fact that the heat dissipation module passively conducts heat to the D-cover of the electronic device through the air flow, and then conducts the heat to the outside through the D-cover, the heat dissipation efficiency is low, and the heat dissipation fan actively conducts the heat of the heat dissipation module to the D-cover. -cover, causing the problem of incre...

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Abstract

The invention discloses electronic equipment and a heat dissipation method therefor, and aims to improve heat dissipation efficiency of the electronic equipment and reduce power consumption and noise of the electronic equipment. The method comprises the steps of detecting whether the bottom shell D-cover of the electronic equipment is in contact with a human body or not; and when the D-cover of the electronic equipment is not in contact with the human body, controlling the D-cover to be connected with a heat dissipation module.

Description

technical field [0001] The present disclosure relates to the technical field of electronic equipment, and in particular, to a method for dissipating heat from an electronic equipment and the electronic equipment. Background technique [0002] With the continuous development of electronic assembly technology, the volume of electronic equipment tends to be miniaturized and the system tends to be complicated. High heat density has become an irresistible development trend. In order to meet the demand of high heat density, heat dissipation methods such as fans and radiators have become standard configurations of electronic equipment, such as desktop PCs and notebooks. Continuous innovation, novel and efficient heat dissipation methods emerge in endlessly. [0003] The radiator is located inside the electronic device, and conducts heat through the bottom surface (D-cover) of the electronic device through air conduction. However, when the cooling fan is not running, the passive co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20209H05K7/2039
Inventor 郭伟
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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