Curved gate-drain compound field plate current aperture heterojunction device
A compound field and arc-shaped technology, applied in the field of microelectronics, can solve the problems that the field plate structure cannot effectively modulate the electric field distribution in the device, the reverse blocking function cannot be realized, and the performance of the device has not been improved, so as to avoid the complexity of the process problems, increased area, and improved breakdown voltage
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0074] Embodiment one: using SiO 2 The material is used as a passivation layer to make an arc-shaped gate-drain compound field plate current aperture heterojunction device.
[0075] Step 1. Epitaxial n on substrate 1 - type GaN, forming a drift layer 2, such as image 3 a.
[0076] use n - Type GaN is used as the substrate 1, and the epitaxial thickness is 3 μm and the doping concentration is 1×10 on the substrate 1 by metal organic chemical vapor deposition technology. 15 cm -3 the n - type GaN semiconductor material to form a drift layer 2, wherein:
[0077] The process conditions used for epitaxy are: the temperature is 950°C, the pressure is 40Torr, and the SiH 4 As the doping source, the flow rate of hydrogen gas is 4000 sccm, the flow rate of ammonia gas is 4000 sccm, and the flow rate of gallium source is 100 μmol / min.
[0078] Step 2. Epitaxial n-type GaN on the drift layer to form an aperture layer 3, such as image 3 b.
[0079] Using metal-organic chemical...
Embodiment 2
[0133] Embodiment 2: SiN material is used as a passivation layer to fabricate an arc-shaped gate-drain compound field plate current aperture heterojunction device.
[0134] Step 1. Epitaxial n on substrate 1 - type GaN, forming a drift layer 2, such as image 3 a.
[0135] At a temperature of 1000°C and a pressure of 45Torr, SiH 4 is the dopant source, the flow rate of hydrogen gas is 4400 sccm, the flow rate of ammonia gas is 4400 sccm, and the flow rate of gallium source is 110 μmol / min. - Type GaN is used as the substrate 1, using metal organic chemical vapor deposition technology, the epitaxial thickness is 30 μm on the substrate 1, and the doping concentration is 1×10 17 cm -3 the n - type GaN material to complete the fabrication of the drift layer 2 .
[0136] The second step. Epitaxial n-type GaN on the drift layer to form the aperture layer 3, such as image 3 b.
[0137] At a temperature of 1000°C and a pressure of 45Torr, SiH 4 As the doping source, the flow...
Embodiment 3
[0181] Embodiment 3: Fabricate a curved gate-drain compound field plate current aperture heterojunction device whose passivation layer is SiN.
[0182] Step A. The temperature is 950°C, the pressure is 40Torr, and SiH 4 As the doping source, the flow rate of hydrogen gas is 4000 sccm, the flow rate of ammonia gas is 4000 sccm, and the flow rate of gallium source is 100 μmol / min. - Type GaN is used as the substrate 1, and the epitaxial thickness is 50 μm and the doping concentration is 1×1018 cm -3 the n - Type GaN material, making drift layer 2, such as image 3 a.
[0183] Step B. The temperature is 950°C, the pressure is 40Torr, and SiH 4 is the dopant source, the flow rate of hydrogen gas is 4000 sccm, the flow rate of ammonia gas is 4000 sccm, and the flow rate of gallium source is 100 μmol / min. Using metal organic chemical vapor deposition technology, the epitaxial thickness on the drift layer 2 is 3 μm, and the doping concentration is 1×10 18 cm -3 The n-type GaN ...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
width | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com