Composite field plate power device based on right angle source field plate and right angle drain field plate
A power device and source field plate technology, applied in the field of microelectronics, can solve the problems of reducing device yield, cumbersome process debugging, and increasing device difficulty, so as to improve reliability, increase reverse breakdown voltage, and improve forward and Effect of Reverse Breakdown Voltage
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Embodiment 1
[0048] Embodiment one: making substrate is sapphire, and passivation layer is Al 2 o 3 , the protective layer is SiO 2 , The right-angle source field plate and the right-angle drain field plate are Ti / Mo / Au metal composite compound field plate power devices based on the right-angle source field plate and the right-angle drain field plate.
[0049] Step 1. On the sapphire substrate 1, make the transition layer 2 by epitaxial GaN material from bottom to top, such as image 3 a.
[0050] An undoped transition layer 2 with a thickness of 1 μm is epitaxially formed on the sapphire substrate 1 by metal organic chemical vapor deposition technology, and the transition layer is composed of GaN materials with thicknesses of 30 nm and 0.97 μm from bottom to top. The process conditions used for the epitaxial lower layer GaN material are: temperature 530°C, pressure 45 Torr, hydrogen gas flow rate 4400 sccm, ammonia gas flow rate 4400 sccm, gallium source flow rate 22 μmol / min; the proc...
Embodiment 2
[0069] Embodiment 2: The substrate is made of silicon carbide, and the passivation layer is SiO 2 , the protective layer is SiN, the right-angle source field plate and the right-angle drain field plate are Ti / Ni / Au metal combination, and the composite field plate power device based on the right-angle source field plate and the right-angle drain field plate.
[0070] Step 1. Epitaxially AlN and GaN materials on the silicon carbide substrate 1 to form the transition layer 2, such as image 3 a.
[0071] 1.1) Using metal-organic chemical vapor deposition technology to epitaxially undoped AlN material with a thickness of 50nm on the silicon carbide substrate 1; The gas flow rate is 4600 sccm, and the aluminum source flow rate is 5 μmol / min;
[0072]1.2) Using metal-organic chemical vapor deposition technology to epitaxially GaN material with a thickness of 2.45 μm on the AlN material to complete the fabrication of the transition layer 2; the epitaxy process conditions are: tempe...
Embodiment 3
[0103] Embodiment three: the substrate is made of silicon, the passivation layer is SiN, and the protective layer is SiO 2 , The right-angle source field plate and the right-angle drain field plate are Ti / Pt / Au metal composite compound field plate power devices based on the right-angle source field plate and the right-angle drain field plate.
[0104] Step A. Epitaxial AlN and GaN materials on the silicon substrate 1 from bottom to top to make the transition layer 2, such as image 3 a.
[0105] A1) Using metal-organic chemical vapor deposition technology at a temperature of 800° C., a pressure of 40 Torr, a flow rate of hydrogen gas of 4000 sccm, a flow rate of ammonia gas of 4000 sccm, and a flow rate of aluminum source of 25 μmol / min, the epitaxy on the silicon substrate 1 AlN material with a thickness of 200nm;
[0106]A2) Using metal-organic chemical vapor deposition technology at a temperature of 980°C, a pressure of 45 Torr, a flow rate of hydrogen gas of 4000 sccm, a...
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