A substrate pick-and-place and transfer device

Abstract

The invention discloses a substrate taking, putting and transferring device. The device includes a first taking and putting assembly, a second taking and putting assembly and a transferring assembly; a first linear robot of the first taking and putting assembly drives a first vacuum sucker through a first cylinder, and performs reciprocating motion among an initial position, a first reaction position and a first taking and putting position in sequence; a second linear rotor of the second taking and putting assembly drives a second vacuum sucker through a second cylinder, and performs reciprocating motion between a second taking and putting position and a second reaction position in sequence, wherein the second reaction position is arranged in correspondence with a second reaction zone; and a substrate support plate of the transferring assembly is arranged between the first taking and putting position and the second taking and putting position, and a third linear rotor of the transferring assembly drives the substrate support plate to perform reciprocating motion between the first taking and putting position and the second taking and putting position. The substrate taking, putting and transferring device automatically completes transferring, taking and putting of a substrate through the transferring assembly and the first and second taking and putting assemblies, avoids low efficiency and dangerousness of manual operation, and can realize safe and efficient transferring, taking and putting of the substrate.

Description

technical field [0001] The invention belongs to the field of atomic layer deposition film preparation, and more specifically relates to a substrate pick-and-place and transfer device, which is used for pick-and-place and transfer the substrates prepared by atomic layer deposition films. Background technique [0002] With the development of the semiconductor industry, integrated circuits, and the urgent need for micro-devices, people have put forward new requirements for thin-film technology, that is, the film thickness is getting smaller and better, and the uniformity is getting better. However, traditional deposition processes, such as physical vapor deposition (PVD) and chemical vapor deposition (CVD), have been difficult to meet people's needs. Atomic layer deposition (ALD) is an emerging thin film processing technology, which is to pass the gaseous precursor into the reactor in the form of alternating pulses and undergo adsorption reaction with the substrate in the react...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the above defects or improvement needs of the prior art, the present invention aims to provide a mechanical device for automatically picking, placing and transferring substrates for preparing atomic layer deposition films, which is used to solve the problem that the current spatially isolated atomic layer equipment cannot be automated The problem of substrate transfer and pick-and-place improves production efficiency, and at the same time avoids the dangerous operation of manual transfer and pick-and-place

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