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Method for measuring adhesion between profile and substrate by using bare optical fiber gratings

A technology of grating measurement and bonding performance, which is applied in the direction of measuring devices, analyzing materials, and adopting mechanical devices, etc., can solve the problems of complex operation and adverse effects of bond-slip performance measurement, and achieve high sensitivity, flexible layout, and operation methods simplified effect

Inactive Publication Date: 2017-07-28
BEIJING JIAOTONG UNIV
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Problems solved by technology

Due to the large number of strain measurement points, the external attachment of multiple optical fibers will also have an adverse effect on the measurement of bond-slip performance, and the operation is complicated

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  • Method for measuring adhesion between profile and substrate by using bare optical fiber gratings
  • Method for measuring adhesion between profile and substrate by using bare optical fiber gratings
  • Method for measuring adhesion between profile and substrate by using bare optical fiber gratings

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Embodiment Construction

[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0032] Those skilled in the art will understand that unless otherwise stated, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the word "comprising" used in the description of the present invention refers to the presence of said features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, Integers, steps, operations, elements, components, and / or groups thereof. It will be understoo...

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Abstract

The present invention provides a method for measuring the adhesion between a profile and a substrate by using bare optical fiber gratings. The method comprises: selecting measurement points inside a profile or on the surface of the profile; setting an optical fiber arrangement path according to all the measurement points, arranging optical fibers on the optical fiber arrangement path, and arranging bare optical fiber gratings on the optical fibers, wherein the bare optical fiber grating is corresponding to the measurement point; and adhering the profile and a substrate to be tested to form a connection body, performing a bond slip test on the connection body, and obtaining the temperature change and the strain change of the connection body during the bond slip test through the bare optical fiber gratings. According to the present invention, the used optical fiber grating sensor has advantages of high sensitivity, high precision and flexible arrangement compared t the traditional strain sheet, and can be widely used in the experimental study; and the method has little effect on the mechanical properties of steel bars, and has good applicability, the operation method is substantially simplified and has applicability, and the precision can be ensured.

Description

technical field [0001] The invention relates to the technical field of bond-slip measurement, in particular to a method for measuring the bond performance between a profile and a substrate by using a bare fiber grating. Background technique [0002] The basis for profiles (such as steel bars, FRP bars, section steel, etc.) and the body (such as concrete, wood, etc.) to work together is the bonding force between the two. Good bonding can make the deformation between the two consistent. And the stress can be well transmitted between them, so the quality of bonding directly affects the bearing capacity of bonded components. Therefore, the study of bond-slip theory has important engineering application value. [0003] The bond-slip problem between the profile and the matrix also plays a very important role in the theoretical research. With the continuous deepening of nonlinear finite element research, new requirements are put forward for the bond-slip, in order to simulate the ...

Claims

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Application Information

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IPC IPC(8): G01N19/04
CPCG01N19/04
Inventor 周长东阿斯哈
Owner BEIJING JIAOTONG UNIV
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