Solder paste stirring equipment used in electronic product manufacturing
A technology for electronic products and stirring equipment, which is used in mixer accessories, mixers with rotary stirring devices, and dissolution, and can solve the problems of low stirring efficiency and complicated operation.
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Embodiment 1
[0030] A solder paste mixing equipment used in the manufacture of electronic products, such as Figure 1-5 As shown, it includes a bottom plate 1, a right frame 2, a first motor 3, a clamping mechanism 4, a top plate 5, a stirring mechanism 6, a first fixed pulley 7 and a second fixed pulley 8, and the right frame 2 is installed on the top right end of the bottom plate 1. , the bottom of the left side of the right frame 2 is equipped with a first motor 3, the top of the bottom plate 1 is equipped with a clamping mechanism 4, the clamping mechanism 4 is connected with the left side of the first motor 3, and the upper left side of the right frame 2 is equipped with a stirring mechanism 6, The top of the right frame 2 is connected with a top plate 5, a first fixed pulley 7 is installed on the right side of the bottom of the top plate 5, a second fixed pulley 8 is installed on the left side of the bottom of the top plate 5, and the solder paste bucket 9 can be placed on the clampin...
Embodiment 2
[0032] A solder paste mixing equipment used in the manufacture of electronic products, such as Figure 1-5 As shown, it includes a bottom plate 1, a right frame 2, a first motor 3, a clamping mechanism 4, a top plate 5, a stirring mechanism 6, a first fixed pulley 7 and a second fixed pulley 8, and the right frame 2 is installed on the top right end of the bottom plate 1. , the bottom of the left side of the right frame 2 is equipped with a first motor 3, the top of the bottom plate 1 is equipped with a clamping mechanism 4, the clamping mechanism 4 is connected with the left side of the first motor 3, and the upper left side of the right frame 2 is equipped with a stirring mechanism 6, The top of the right frame 2 is connected with a top plate 5, a first fixed pulley 7 is installed on the right side of the bottom of the top plate 5, a second fixed pulley 8 is installed on the left side of the bottom of the top plate 5, and the solder paste bucket 9 can be placed on the clampin...
Embodiment 3
[0035] A solder paste mixing equipment used in the manufacture of electronic products, such as Figure 1-5 As shown, it includes a bottom plate 1, a right frame 2, a first motor 3, a clamping mechanism 4, a top plate 5, a stirring mechanism 6, a first fixed pulley 7 and a second fixed pulley 8, and the right frame 2 is installed on the top right end of the bottom plate 1. , the bottom of the left side of the right frame 2 is equipped with a first motor 3, the top of the bottom plate 1 is equipped with a clamping mechanism 4, the clamping mechanism 4 is connected with the left side of the first motor 3, and the upper left side of the right frame 2 is equipped with a stirring mechanism 6, The top of the right frame 2 is connected with a top plate 5, a first fixed pulley 7 is installed on the right side of the bottom of the top plate 5, a second fixed pulley 8 is installed on the left side of the bottom of the top plate 5, and the solder paste bucket 9 can be placed on the clampin...
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