Refrigerating-heating wood floor system

A technology for heating and cooling wood and wooden floors, applied in heating and ventilation control systems, heating and ventilation safety systems, air conditioning systems, etc., can solve the problems of high heating energy consumption, long delay of control, and limited control range, and achieve control response Fast, low-energy effect

Inactive Publication Date: 2017-05-31
重庆元云联科技有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

[0003] The invention provides a cooling and heating wooden floor system to solve the problems of high energy consumption, high cost, long control delay and limited control range of traditional winter and summer cooling and heating

Method used

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  • Refrigerating-heating wood floor system

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Embodiment Construction

[0016] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, and to make the above-mentioned purposes, features and advantages of the embodiments of the present invention more obvious and understandable, the following describes the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings For further detailed explanation.

[0017] As shown in the figure, a heating and cooling wooden floor system includes a wooden floor 1 and a semiconductor energy-attached board 2. Several semiconductor energy-attached boards are installed in the wooden floor and connected in series, and two parallel clamps are arranged on the semiconductor energy-attached board. The heat conduction plate 21 with a holding structure, two or more semiconductor materials 22 are arranged between the heat conduction plates, and the heat insulating glue 23 is used to seal the heat betwe...

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Abstract

The invention provides a refrigerating-heating wood floor system which comprises a wood floor and a semiconductor energy adhesion plate. The semiconductor energy adhesion plate is provided with two heat conduction plates, and at least two semiconductor materials and heat insulating glue are arranged between the heat conduction plates; the wood floor comprises an upper faceplate and a lower faceplate, a cavity clamping the semiconductor energy adhesion plate is arranged between the upper faceplate and the lower faceplate, and heat insulating materials are arranged on two sides of the cavity. The refrigerating-heating wood floor system is used for solving the problem that conventional refrigerating and heating in winter and summer are high in energy consumption, high in cost, long in regulation time delay and limited in regulation range.

Description

technical field [0001] The invention relates to the field of smart home, in particular to a heating and cooling wooden floor system. Background technique [0002] Wood flooring has been widely used in home decoration because of its beautiful, thermal insulation and comfortable texture. In our country, due to the large temperature difference between winter and summer, in the high temperature weather in summer, the temperature reaches above 35°C, and the temperature in winter is as low as minus 10°C. This temperature difference phenomenon is a common phenomenon in most cities in my country. The existing summer cooling method Mainly to install air conditioners, air cooling is carried out through compressors; floor heating is installed indoors in winter, traditional floor heating uses water pipes, and circulating heat pipes are used to heat the wall through circulating heating water pumps; the above traditional methods are two systems respectively, and the installation cost High,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24F5/00F24F11/02F24F13/00
CPCF24F5/0042F24F11/89F24F13/00F24F2221/40
Inventor 仲元昌
Owner 重庆元云联科技有限公司
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