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Tensile testing device for flexible hinge micro-components with clamping centering guide

A flexible hinge and tensile testing technology, used in measuring devices, using stable tension/pressure to test material strength, strength characteristics, etc. Micro-displacement loading, complex sample preparation, etc., to achieve the effects of low cost, overcoming experimental errors, and convenient experimental operation

Active Publication Date: 2019-01-11
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These testing techniques also have shortcomings such as difficulty in micro-force and micro-displacement loading, poor alignment, and complicated sample preparation, and cannot be adapted to clamping and tensile testing of various film materials.

Method used

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  • Tensile testing device for flexible hinge micro-components with clamping centering guide
  • Tensile testing device for flexible hinge micro-components with clamping centering guide
  • Tensile testing device for flexible hinge micro-components with clamping centering guide

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Experimental program
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Embodiment Construction

[0038] like figure 1 As shown, in this embodiment, the flexible hinge micro-component tensile test device with clamping and centering guidance includes: a movable end clamping mechanism 3, a fixed end clamping mechanism 5, a loading mechanism 1, a centering mechanism, and a tension sensor 2 , grating sensor 4, movable end supporting mechanism 16 and fixed end supporting mechanism;

[0039] like Figure 2a As shown, the movable end support mechanism 16 includes: a loading mechanism workbench 23, a base 18, a movable end clamping mechanism workbench 20 and a precision linear guide rail 19;

[0040]A loading mechanism workbench 23 and a precision linear guide rail 19 are respectively arranged on the base 18, and the symmetry axes of the loading mechanism workbench 23 and the precision linear guide rail 19 are on the same vertical plane; The clamping mechanism workbench 20; the movable end clamping mechanism 3 is arranged on the movable end clamping mechanism workbench 20, so th...

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PUM

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Abstract

The invention discloses a flexible hinge micro-component tensile testing device with clamping centering guide functions. The flexible hinge micro-component tensile testing device is characterized by comprising clamping mechanisms, a loading mechanism, a centering mechanism, a tension sensor, a grating sensor, a movable-end supporting mechanism and a fixed-end supporting mechanism. The flexible hinge micro-component tensile testing device has the advantages that clamping required by micro-component tensile tests and micro-nano-scale precision loading can be implemented, the flexible hinge micro-component tensile testing device is excellent in centering in clamping and tensile procedures, and accordingly the shortcoming of measurement errors due to deficiency of clamping centering in existing testing methods can be overcome; the flexible hinge micro-component tensile testing device is convenient to operate and low in cost.

Description

technical field [0001] The invention relates to a mechanical performance testing device for micro-nano materials in the technical field of thin film materials, in particular to a tensile testing device for flexible hinge micro-components with clamping and centering guidance. Background technique [0002] With the rapid development of micro-electromechanical systems (MEMS) technology, micro-components of various materials are widely used in micro-devices. The size of MEMS micro-components generally ranges from millimeters to microns. Due to factors such as processing technology, size effects, and surface defects, the mechanical properties of materials at the micro-scale and those at the macro-scale may vary greatly. Therefore, the mechanical properties of micro-components are an important theoretical basis for the study of MEMS, and are very important for the reliability design of MEMS devices. Uniaxial tensile test is the most direct method to measure parameters such as mat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/08
CPCG01N3/08G01N2203/0017
Inventor 王标宁晓旭王永红
Owner HEFEI UNIV OF TECH
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