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Method for preparing white-light LED package device with high color rendering index

A technology of LED packaging and high CRI, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of low color rendering index, achieve low color rendering index, easy monitoring of process flow, and reduce blue light output Effect

Active Publication Date: 2017-05-10
ELEC TECH PHOTOELECTRIC TECH DALIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to solve the deficiencies in the prior art, the purpose of the present invention is to effectively improve the color rendering index of white LED devices, solve the problem of low color rendering index of white LED devices, and provide a method for preparing high color rendering index white LED packaging devices

Method used

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  • Method for preparing white-light LED package device with high color rendering index

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Embodiment 1

[0034] A method for preparing a high CRI white LED packaging device, comprising the following steps:

[0035] Step 1, use the existing technology to carry out crystal bonding on the 5555 chip, mix the fluorescent powder, silica gel and thinner for R1 type nitride red LED according to the mass percentage ratio of 1:1:1, and use a planetary vacuum mixer to mix evenly, and prepare Fluorescent paste, use atomization spraying machine to spray, apply R1-type nitride red fluorescent paste to the upper surface of the chip substrate after crystal bonding, spray the first layer, and bake at 150°C for 10 minutes;

[0036] Step 2, then, on the basis of step 1, use the red rubber powder mixture that sprays the second layer and bakes at 150°C for 5 minutes; sprays the third layer and bakes at 150°C for 5 minutes; until it reaches the preset thickness index;

[0037] Step 3: Next, mix the silica gel, diluent and LY1 aluminate yellow-green LED fluorescent powder according to the mass percenta...

Embodiment 2

[0042] A method for preparing a high CRI white LED packaging device, comprising the following steps:

[0043] Step 1: Use the existing technology to carry out crystal bonding on the 5555 chip, and mix the silica gel, diluent and R4-type nitride LED phosphor powder with a planetary vacuum mixer according to the mass percentage ratio of 1.5:1:1 to prepare the fluorescent powder. Slurry, use atomization spraying machine to spray, apply R4 type nitride red fluorescent slurry to the upper surface of the chip substrate after crystal bonding, spray a layer, and bake at 150°C for 10 minutes;

[0044] Step 2: Next, mix the silica gel, diluent and LY1 aluminate yellow-green LED fluorescent powder according to the mass percentage ratio of 1:1:1, stir evenly with a planetary vacuum mixer, and use an atomizing sprayer, Apply the LY1-type aluminate yellow-green fluorescent slurry to the surface of the R4-type nitride red fluorescent adhesive layer after step 2 by using the atomization spray...

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Abstract

The invention provides a method for preparing a white-light LED package device with a high color rendering index. The white-light LED package device with the high color rendering index is prepared by atomizing and spraying fluorescent powders on a flip LED chip. By adopting the method provided by the invention, the color rendering index of the white-light LED package device can be effectively improved, and the color rendering index of the LED package device prepared from the same chip, silica gel and fluorescent powders can be improved to about 1 to 5; a problem that the white-light LED device has a relatively lower color rendering index is greatly solved, and the method is more suitable for the development tendency of the white-light LED device with the high color rendering index.

Description

[0001] 【Technical field】 [0002] The invention relates to a preparation technology of a photoelectric device, in particular to a method for preparing a high CRI white LED packaging device. [0003] 【Background technique】 [0004] LED is a semiconductor component, known as the fourth-generation lighting source or green light source, which has the characteristics of energy saving, environmental protection, long life, small size, etc., and is widely used in various indications, displays, decorations, backlights, flashlights, car lights , general lighting and urban night scenes; according to statistics, if all lighting fixtures are replaced with LED lights, the world will save at least 1.52 trillion kwh of electricity every year, reduce coal consumption by at least 500 million tons, and reduce carbon dioxide emissions by 1.3 billion tons. Sulfur dioxide emissions are 4.2 million tons. Since October 1, 2016, my country has banned the sale and import of incandescent lamps for general ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/54
CPCH01L33/504H01L33/505H01L33/54H01L2933/0041H01L2933/005
Inventor 王冬雷边福强陈泰良张文杰朱坤刘海升
Owner ELEC TECH PHOTOELECTRIC TECH DALIAN
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