Resin composition and solar cell encapsulation adhesive film
A resin composition and composition technology, which can be used in circuits, adhesives, photovoltaic power generation, etc., can solve the problems of easy bubbles, easy bonding, and dirty components, and achieve the effect of preventing bubbles and sticky glue overflow.
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Embodiment 1-7
[0045] Polyolefin, tackifier, crosslinking initiator, coupling agent, optional auxiliary crosslinking agent and optional antiaging agent are mixed to obtain a mixture, and in extrusion casting equipment (purchased from Nanjing Yuesheng Company) Through twin-screw extrusion, film formation by salivation (the specific conditions are that the temperature of the main body of the extruder is 60-80° C., and the temperature of the mold is 100° C.), to obtain the films S1-S7. The components and amounts used in each of the above examples are shown in Table 1.
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