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A clamping and conveying device for a square substrate with a hole

A square substrate, clamping transmission technology, applied to the direction of conveyor objects, transportation and packaging, electrical components, etc., can solve the problem of not being able to absorb porous substrates, etc., to achieve firm grasping, accuracy assurance, and easy replacement Effect

Active Publication Date: 2019-02-26
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that the vacuum conveying and fixing method cannot absorb the substrate with holes, the purpose of the present invention is to provide a clamping and conveying device for square substrates with holes

Method used

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  • A clamping and conveying device for a square substrate with a hole
  • A clamping and conveying device for a square substrate with a hole

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Embodiment Construction

[0017] The present invention will be described in further detail below with reference to the drawings.

[0018] Such as figure 1 , figure 2 As shown, the present invention includes a manipulator mounting base 1, a linear finger mounting base 2, a linear finger 3, a two-way sliding table 4, and an L-shaped finger 5. One end of the manipulator mounting base 1 is connected to the manipulator and moves with the manipulator. A two-way sliding table 4 is installed on the lower surface of the other end, and two inline finger mounting seats 2 are symmetrically provided on both sides of the two-way sliding table 4.

[0019] Each inline finger mounting seat 2 is of an "L" shape and is fixed on the lower surface of the manipulator mounting seat 1, and each inline finger mounting seat 2 is fixedly connected to a font finger 3.

[0020] The inline fingers 3 on both sides of the two-way sliding table 4 are arranged symmetrically at the same height, each inline finger 3 is rectangular, one end is...

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Abstract

The invention belongs to the field of scrubbing and cleaning in the semiconductor industry, and specifically relates to a clamping conveyer of a square substrate with holes. A bidirectional slide unit is arranged on a manipulator installing seat, two sides of the bidirectional slide unit are both provided with a linear finger installing seat arranged on the manipulator installing seat, each linear finger installing seat is connected with a linear finger, an L-shaped finger is arranged under each linear finger, one end of each L-shaped finger is connected with the bidirectional slide unit, the other end is upwardly bent to form the L shape, the linear fingers and the L-shaped fingers are moved with the manipulator installing seat, the linear fingers at two sides bear the square substrate with holes in sequence, and the L-shaped fingers at the same side are driven by the bidirectional slide unit to realize clamping. Compared with taking and conveying methods such as vacuum adsorption, according to the clamping conveyer, the grabbing is firmer, position change of the substrate in the conveying process is avoided, and the problem of transmission of the substrates with holes and liquid is solved.

Description

Technical field [0001] The invention belongs to the field of wipe cleaning in the semiconductor industry, in particular to a clamping and conveying device for a square substrate with holes. Background technique [0002] At present, some companies use square ceramic substrates with holes for their products. The holes on the square substrate are laser-punched, with a diameter of about 0.2mm. After laser-punching, the melt deposited on the surface of the substrate needs to be brushed off to facilitate subsequent process production. Removal of the melt on the surface of the substrate requires a combination of chemical liquid washing and brush rotation. Therefore, the substrate needs to have a supporting part, and there will be a small amount of liquid residue on the supporting surface of the substrate. There will be liquid and The pick-up device is in contact, so the pick-up device needs to deal with liquid. The conventional conveying and fixing method of the substrate generally ad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/687
CPCH01L21/677H01L21/68707
Inventor 符平平
Owner SHENYANG KINGSEMI CO LTD
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