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Three-dimensional mechanical modal simulation method based on hierarchical basis function

An analog method and basis function technology, which is applied in design optimization/simulation, electrical digital data processing, special data processing applications, etc., can solve the problems that the accuracy of low-order basis functions cannot meet the requirements of designers, etc.

Active Publication Date: 2017-01-25
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology

With the complexity of the analysis structure, the accuracy of low-order basis functions can no longer meet the requirements of designers, so it is necessary to construct high-order basis functions to realize finite element analysis

Method used

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  • Three-dimensional mechanical modal simulation method based on hierarchical basis function
  • Three-dimensional mechanical modal simulation method based on hierarchical basis function
  • Three-dimensional mechanical modal simulation method based on hierarchical basis function

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Embodiment Construction

[0040] The technical solutions of the present invention will be described in detail below with reference to the drawings and embodiments.

[0041] Reference figure 1 , A three-dimensional mechanical modal simulation simulation method based on laminated basis functions, including the following steps:

[0042] A. Model the target electronic device structure, introduce displacement boundary conditions or stress boundary conditions to establish a corresponding geometric structure model.

[0043] According to the characteristics of electronic devices, the displacement boundary conditions are introduced to establish the corresponding geometric structure model to simulate the vibration characteristics of the entire structure.

[0044] B. Establish the basic boundary value problem matrix form of linear elastic mechanics of electronic device structure.

[0045] For the space boundary value problem, within the structure (elastic body), we have to consider the three conditions of statics, geometry...

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Abstract

The invention belongs to the technical field of three-dimensional mechanical vibration analysis numerical solution and relates to a three-dimensional mechanical modal simulation method based on a hierarchical basis function. Firstly, modeling is conducted on a target electronic device, displacement or stress boundary conditions are introduced for building a corresponding geometric structure model, and a tetrahedral mesh generation solution domain is adopted; secondly, by selecting the scalar hierarchical basis function, displacement is expanded in all meshes through the scalar hierarchical basis function, and a finite element equation of the target electronic device structure is obtained by means of the canonical variational principle; finally, the equation is solved to obtain a feature value and a feature vector, and vibration modal frequency and vibration mode are obtained through post-processing. Thus, the high-order basis function is quickly constructed, and high-precision numerical calculation results are obtained.

Description

Technical field [0001] The invention belongs to the technical field of numerical solution of three-dimensional mechanical vibration analysis, and relates to a three-dimensional mechanical modal simulation simulation method based on laminated basis functions. Background technique [0002] The use environment of electronic devices is often very harsh. For example, vibration during transportation on rugged roads, aircraft take-off, high-speed tanks, satellites and missiles in the ascent phase of gravity acceleration, etc., put forward very strict requirements on the mechanical strength of electronic devices. Mechanical performance is an important part of the reliability and stability of electronic devices, which directly affects whether the device can work normally. Therefore, it is necessary to optimize the mechanical performance of electronic devices. Modal analysis can obtain the vibration characteristics of electronic devices, which is an important part of its mechanical perform...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/23G06F2119/06
Inventor 尹俊辉徐立李斌
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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