Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Butterfly type packaging semiconductor laser heat sink apparatus

A technology of semiconductor and laser, applied in the field of heat sink of butterfly packaged semiconductor laser, which can solve the problems of heavy weight and large volume, and achieve the effect of light weight, small volume and improved heat dissipation efficiency

Inactive Publication Date: 2017-01-18
BEIJING INFORMATION SCI & TECH UNIV
View PDF7 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of heat sink design is used in daily life, such as the installation design of heating radiators. Although it can achieve heat dissipation, it is bulky and heavy.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Butterfly type packaging semiconductor laser heat sink apparatus
  • Butterfly type packaging semiconductor laser heat sink apparatus
  • Butterfly type packaging semiconductor laser heat sink apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Figure 1a , Figure 1b , Figure 1c Shown is a schematic diagram of the structure of a butterfly package semiconductor laser heat sink device, where Figure 1a It is the front view of the butterfly package semiconductor laser heat sink device, Figure 1b It is the left view of the butterfly package semiconductor laser heat sink device, Figure 1c It is a top view of a butterfly package semiconductor laser heat sink device, which specifically includes: a heat sink base plate 101, a heat dissipation platform 102, a mounting hole 103, a PCB circuit board 104 and a butterfly package semiconductor laser 105. Among them, the shape of the heat sink base plate 101 is rectangular, and the material is light metal aluminum material with high thermal conductivity. The size of the heat sink base plate 101 matches the size of the drive control circuit PCB circuit board 104 of the butterfly package semiconductor laser; the mounting hole 103 is located At the four corners of the heat sink ...

Embodiment 2

[0037] Figure 2a , Figure 2b , Figure 2c It is a structural design drawing of the heat dissipation platform 102.

[0038] among them, Figure 2a Shown is a rectangular cooling platform. The cooling fins are comb-shaped, rectangular in shape and uniformly distributed in strips. In order to be suitable for different types of lasers, the cooling platform has a length of 25cm-30cm, a width of 13cm-20cm, and a height of 4cm-10cm. The spacing of the cooling fins of the cooling platform is 0.5cm-1.5cm, and the height is 3cm-8cm. The size of the cooling platform is smaller than the size of the heat sink bottom plate.

[0039] A common tunable semiconductor laser has a length of 24.410cm and a width of 12.700cm. The size of the heat dissipation platform is suitable for semiconductor lasers; the distance between the heat sinks is 0.5cm—1.5cm, the number of heat sinks of the heat dissipation platform is 15-60, and the heat sink height 3cm-8cm.

[0040] Figure 2b Shown is a rectangular coo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a butterfly type packaging semiconductor laser heat sink apparatus. The apparatus comprises a heat sink base plate and a heat dissipation platform, wherein installation holes are arranged at four corners of the heat sink base plate, the installation holes are used for fixing a PCB and a support part, the position, which is used for welding a butterfly type packaging semiconductor laser, of the PCB is hollow, the heat dissipation platform is disposed between the heat sink base plate and the abdomen of the butterfly type packaging semiconductor laser, the heat dissipation platform is in a hollow form, and the heat dissipation platform is provided with four installation holes. Through combination of the heat sink base plate and the heat dissipation platform, the heat dissipation efficiency is improved, the thermal conductivity is high, the work temperature of the butterfly type packaging semiconductor laser is stable, the heat sink material is light aluminum, the volume is small, the weight is small, the structure is simple, the installation is convenient, the weight of overall heat sink is quite small, and the requirement of such special occasions as aerospace and the like for light weight is satisfied.

Description

Technical field [0001] The invention relates to the field of all light-weight butterfly packaged semiconductor lasers, in particular to a butterfly packaged semiconductor laser heat sink. Background technique [0002] Lightweight butterfly packaged semiconductor lasers include all butterfly semiconductor lasers based on DFB, DBR semiconductor lasers and tunable semiconductor lasers. As the main part of the laser branch, semiconductor lasers are widely used as light sources in the fields of optical communications, optical information processing, and optical fiber sensing due to their light weight, high efficiency, long life, and easy production. The butterfly-type packaged semiconductor laser has been involved in all laser design principles. Therefore, the application of this packaged laser will become more and more widespread. As the power of the butterfly packaged semiconductor laser continues to increase, the power density continues to increase, including the internal integra...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/022H01S5/024
CPCH01S5/02469H01S5/022
Inventor 祝连庆刘佳何巍刘锋董明利娄小平庄炜
Owner BEIJING INFORMATION SCI & TECH UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com