Wafer bearing mechanism convenient to replace

Abstract

A wafer bearing mechanism convenient to replace is used for solving the problem that an existing wafer bearing mechanism is not liable to replace. The mechanism comprises a hot disc, a porcelain sleeve, a porcelain post and a special clamp, wherein a round counter bore is processed in the hot disc, the porcelain sleeve is placed in the counter bore, the porcelain post is placed in the porcelain sleeve, a bevel is fabricated at an edge of an inner hole of the porcelain sleeve, a spherical surface part of the porcelain post can be exposed, and a wedge-shaped groove is formed in the spherical surface part of the porcelain post; when the special clamp is loosened, an opening part of the clamp can pass through the spherical surface part of the porcelain post and sleeves the spherical surface part of the porcelain post, the porcelain post can be pulled out of the porcelain sleeve by upwards pulling the special clamp; and a spherical surface bulge is arranged at a top end of the porcelain post and is used for bearing a wafer, the height between the spherical surface bulge of the porcelain post and an upper surface of the hot disc is measured by a height gauge, the porcelain post is pulled out by the special clamp, a corresponding porcelain post is replaced to reach a required height, all bearing mechanisms on the hot disc are adjusted to the same height by using the same method, so that a gap between the wafer and the hot disc is maintained consistent. The wafer bearing mechanism can be widely applied to the technical field of semiconductor thin film deposition.

Description

technical field [0001] The invention relates to a wafer support mechanism for semiconductor coating equipment. The mechanism is mainly used in the normal temperature or high temperature process in the reaction chamber of the semiconductor coating equipment, and belongs to the application technical field of semiconductor thin film deposition. Background technique [0002] There needs to be a certain gap between the wafer and the hot plate in the semiconductor coating equipment. The size of the gap has a great influence on the process results. The current wafer supporting mechanism cannot be adjusted. It is necessary to replace the wafer supporting mechanism with different heights. To keep the gap consistent, it is difficult to adjust the height in this way, and it is difficult to take out the ceramic column, especially after the hot plate has been subjected to a high-temperature process, it is easy to appear "stuck" and cannot be taken out. Contents of the invention [0003...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above problems, the present invention designs a wafer support mechanism that is easy to replace, and solves the problem that the existing wafer support mechanism is not easy to replace

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