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Middle frame component and electronic device

A technology for electronic equipment and frame components, applied in the field of communication, can solve problems such as electrostatic interference, and achieve the effect of improving anti-static interference

Active Publication Date: 2016-12-07
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a middle frame assembly and electronic equipment; to solve the problem of electrostatic interference caused by the opening of the receiver assembly in the existing mobile terminal equipment

Method used

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  • Middle frame component and electronic device
  • Middle frame component and electronic device
  • Middle frame component and electronic device

Examples

Experimental program
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Effect test

Embodiment 1

[0023] Please refer to figure 1 , figure 1 It is a structural schematic diagram of a preferred embodiment of the middle frame assembly of the present invention. The middle frame assembly 10 includes a frame body 11 and a conductive sound-transmitting layer 12 . The frame body 10 is provided with a through-hole structure 113 for sound transmission, the frame body 11 is provided with a grounded metal area, and the conductive sound-transmitting layer 12 is filled in the through-hole structure 113 and is electrically connected to the grounded metal area.

[0024] Specifically, the frame body 11 includes a plastic frame 111 and a metal middle frame 112, the through-hole structure 113 is opened on the plastic frame 111, and the metal middle frame 112 is installed inside the plastic frame 111 and at the end of the metal middle frame 112. Extending into the via structure 113 , the ground metal area is located on the metal middle frame 112 , or in other words, the metal middle frame 1...

Embodiment 2

[0030] Please also refer to figure 2 as well as image 3 , figure 2 It is a structural diagram of a preferred embodiment of the electronic equipment of the present invention, image 3 for figure 2 A partial cross-sectional view of the area indicated by A of the electronic device. The electronic device may be a mobile terminal such as a mobile phone or an IPAD. The electronic device in this preferred embodiment includes a middle frame assembly 10 , a display panel assembly 20 , a rear cover 30 and a receiver assembly 40 .

[0031] Wherein, the middle frame assembly 10 covers the open surface of the rear cover 30 . The display panel assembly 20 covers the middle frame assembly 10 . The receiver assembly 40 is installed between the middle frame assembly 10 and the rear cover 30 .

[0032] Specifically, the middle frame assembly 10 is the middle frame assembly 10 in the first embodiment. Also refer to figure 1 , the middle frame assembly 10 includes a frame body 11 and...

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PUM

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Abstract

The invention provides a middle frame component and an electronic device. The middle frame component comprises a frame body and a conductive sound transmission layer, wherein a through hole structure for sound transmission is formed in the frame body, the frame body is provided with a grounding metal area, and the through hole structure is filled with the conductive sound transmission layer which is electrically connected with the grounding metal area. According to the middle frame component provided by the invention, the conductive sound transmission layer is arranged in a filling groove on the frame body, and the conductive sound transmission layer is electrically connected with the grounding metal area on the middle frame component, so that static electricity generated at the through hole structure near a receiver component is imported into the grounding metal area, and thus the middle frame component has the beneficial effect of improving the resistance to static interference.

Description

technical field [0001] The invention relates to the communication field, in particular to a middle frame component and electronic equipment. Background technique [0002] At present, the mobile phone is already the most commonly used and most important electronic device for the vast majority of users. Because it is held in the hand for a long time, or placed in the pocket of the trousers, it faces a relatively serious problem of electrostatic discharge, so major manufacturers have to continuously improve their ESD standards. In the entire structure of the mobile phone, there is a problem of anti-ESD vulnerability in unsealed places such as holes, seams, and sockets. The sound outlet at the earpiece of the mobile phone is one of them. Without some follow-up artificial measures, it will not be able to meet consumer demand. The ESD problem faced by the reader when actually using the mobile phone. The receiver component of the mobile phone is also the earpiece, which needs to ...

Claims

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Application Information

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IPC IPC(8): H04M1/02H04M1/03H01R4/64
CPCH01R4/64H04M1/026H04M1/03
Inventor 金文锋
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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