A method for assessing failure rate of mmc
A failure rate and failure model technology, applied in the direction of instruments, AC network circuits, electrical components, etc., can solve the problems of not fully reflecting the reliability of MMC circuits, so as to improve the accuracy of fault estimation, the accuracy of failure rate and average life, and improve the estimation reliability effect
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[0040] Below in conjunction with accompanying drawing of description, the present invention will be further described.
[0041] The invention provides a failure rate evaluation method of MMC, such as figure 1 shown, including the following steps:
[0042] 1) Obtain the submodule and submodule assembly of the MMC circuit;
[0043] Such as figure 2 Shown is the MMC circuit topology diagram, in which each box represents a sub-module, the sub-module adopts the structure of a half-bridge sub-module, and the sub-module components in each sub-module include IGBT, capacitor and diode.
[0044] The main cause of sub-module failure is the damage of power electronic devices. The overload capacity of power electronic devices such as IGBT and diodes is weak. Overvoltage, overcurrent or excessive voltage and current rise rate may cause damage to power electronic devices, and capacitor Damage and trigger control failure etc. The failure of the sub-module will cause the oscillation of DC...
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