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Chip single event effect detection method and device

A detection method and single-chip technology, applied in the field of integrated circuits, can solve the problems of low reliability and cumbersome single event effect, and achieve the effects of less observation cost, efficient reflection, and less testing time.

Active Publication Date: 2019-02-12
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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Problems solved by technology

However, even using pulsed lasers to test the reliability of single event effects is inefficient and cumbersome.

Method used

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  • Chip single event effect detection method and device
  • Chip single event effect detection method and device
  • Chip single event effect detection method and device

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Embodiment Construction

[0048] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Here, the exemplary embodiments and descriptions of the present invention are used to explain the present invention, but not to limit the present invention.

[0049] The inventors found that the use of pulsed lasers in the prior art to test the reliability of single event effects is inefficient and cumbersome. This is because the radiation effect test of existing chips requires test engineers to repeatedly scan and inspect chips for a long time under laser irradiation , to analyze and judge the internal reliability of the chip only by the output results. Even if the wrong result is obtained, it is necessary to analyze and judge the data in combination with the fault analysis method (Fault Analysis) to find the loopholes in ...

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Abstract

A chip single-event effect detection method and device, the method comprising: placing a to-be-detected chip in a testing machine, and triggering the to-be-detected chip to generate a single-event effect; randomly turning off a scanning register for the to-be-detected chip, and forming a random observation matrix; providing an input testing vector for the to-be-detected chip so as to obtain an output testing vector of the to-be-detected chip, and obtaining an error total vector according to the output testing vector; and carrying out compressed sensing signal reconstruction on the error total vector, and determining an internal sensitive region of the to-be-detected chip. The method may be used to efficiently and conveniently detect the single-event effect of a chip.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a chip single event effect detection method and device. Background technique [0002] The importance of integrated circuit reliability research has been highlighted with the rapid progress of the semiconductor industry. The new high-performance chip with small package, high speed and low power consumption has greatly enhanced sensitivity to particle radiation, and can produce many semiconductor ionizing radiation effects, also known as single event effects. figure 1 It is a schematic diagram of semiconductor single event effect caused by incident high-energy particles in the prior art, such as figure 1 As shown, single event effects can cause electronic equipment to deviate from normal function and performance, resulting in reduced reliability of chips and even failure. [0003] In addition to space rays that can cause chip single event effects, a large number of ra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/311
CPCG01R31/311
Inventor 李慧云邵翠萍刘玢玢
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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