A flame-retardant and high-temperature-resistant polyimide composite board and its preparation method

A polyimide and composite board technology, applied in the polymer field, can solve the problems of poor flame retardancy of polyimide materials, reduce the heat resistance of polyimide, reduce the mechanical properties of polyimide, etc. The effect of carbon forming process, improving flame retardant and heat resistance, and increasing stability

Active Publication Date: 2018-11-27
苏州凯姆勒绝缘材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat resistance has a lot to do with the rigid groups in the molecular structure, but due to the commonality of organic matter, the flame retardancy of polyimide materials is poor
The existing technology generally improves the flame retardancy of polyimide by adding flame-retardant fillers or flame-retardant small molecules, and there are obvious problems, such as fillers significantly reducing the mechanical properties of polyimide, small molecules will greatly reduce Amine heat resistance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A method for preparing a flame-retardant and high-temperature-resistant polyimide composite board, comprising the following steps:

[0023] (1) Mix aluminum phosphate, talcum powder and yttrium oxide evenly, sinter at 900°C for 55 minutes, and then pulverize into a powder with an average particle size of 150 nanometers; disperse the powder in ethanol, add isotridecyl alcohol polyoxyethylene Ether, reflux and stir for 35 minutes, then add 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, stir for 15 minutes, and finally dry to obtain the filler; bisphenol A type cyanate Add the monomer into the reactor, react at 95°C for 5 minutes, add methyl p-hydroxybenzoate, lanthanum trifluoromethanesulfonate, raise the temperature to 135°C, then add nonylphenol polyoxyethylene ether, m-aminoacetanilide and titanium Zinc acid, add filler after reacting for 50 minutes, and stir for 2 hours to prepare cyanate prepolymer; powder, ethanol, isomeric tridecanol polyoxyethylene ether, 2,5-dimet...

Embodiment 2

[0028] A method for preparing a flame-retardant and high-temperature-resistant polyimide composite board, comprising the following steps:

[0029] (1) Mix aluminum phosphate, talcum powder and yttrium oxide evenly, then sinter at 900°C for 75 minutes, and then pulverize into a powder with an average particle size of 150 nm; disperse the powder in ethanol, add isotridecyl alcohol polyoxyethylene Ether, reflux and stir for 25 minutes, then add 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, stir for 15 minutes, and finally dry to obtain the filler; bisphenol A cyanate Add the monomer into the reactor, react at 95°C for 8 minutes, add methyl p-hydroxybenzoate and lanthanum trifluoromethanesulfonate, raise the temperature to 130°C, then add nonylphenol polyoxyethylene ether, m-aminoacetanilide and titanium Zinc acid, add filler after reacting for 50 minutes, and stir for 2 hours to prepare cyanate prepolymer; powder, ethanol, isomeric tridecanol polyoxyethylene ether, 2,5-dimethyl-2...

Embodiment 3

[0034] A method for preparing a flame-retardant and high-temperature-resistant polyimide composite board, comprising the following steps:

[0035] (1) Mix aluminum phosphate, talcum powder and yttrium oxide evenly, sinter at 900°C for 55 minutes, and then pulverize into a powder with an average particle size of 150 nanometers; disperse the powder in ethanol, add isotridecyl alcohol polyoxyethylene Ether, reflux and stir for 25 minutes, then add 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane, stir for 15 minutes, and finally dry to obtain the filler; bisphenol A cyanate Add the monomer into the reactor, react at 90°C for 8 minutes, add methyl p-hydroxybenzoate and lanthanum trifluoromethanesulfonate, raise the temperature to 135°C, then add nonylphenol polyoxyethylene ether, m-aminoacetanilide and titanium Zinc acid, add filler after reacting for 50 minutes, and stir for 2 hours to prepare cyanate prepolymer; powder, ethanol, isomeric tridecanol polyoxyethylene ether, 2,5-dimethy...

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Abstract

The invention discloses a flame-retardant high-temperature-resistant polyimide composite board and a preparation method thereof. The preparation method comprises the steps of soaking a polyimide board into coating slurry, taking out the polyimide board after 3-5 minutes, heating at 90 DEG C for 5-8 minutes, soaking the polyimide board into the coating slurry again, taking out the polyimide board after 8-12 minutes, heating at 110 DEG C for 10-15 minutes, and finally carrying out vacuum treatment at 155 DEG C for 40-55 minutes, so as to obtain the flame-retardant high-temperature-resistant polyimide composite board, wherein the thickness of the polyimide board is 92%-95% of that of the flame-retardant high-temperature-resistant polyimide composite board. Tests prove that the glass-transition temperature of the flame-retardant high-temperature-resistant polyimide composite board is 302 DEG C, the initial thermal weight loss temperature is 406 DEG C, the oxygen index is 45, the residual rate at 700 DEG C is 37%, the bending strength is 62 MPa, a fishing edge is not adhered with a cutter, and the cutter does not need to be exchanged after 500 meters of the board is cut.

Description

technical field [0001] The invention belongs to the technical field of macromolecules, and in particular relates to a flame-retardant and high-temperature-resistant polyimide composite board and a preparation method thereof. Background technique [0002] As a high heat-resistant resin, polyimide is widely used in various fields. The heat resistance has a lot to do with the rigid groups in the molecular structure, but due to the commonality of organic matter, the flame retardancy of polyimide materials is poor. The existing technology generally improves the flame retardancy of polyimide by adding flame-retardant fillers or flame-retardant small molecules, and there are obvious problems, such as fillers significantly reducing the mechanical properties of polyimide, small molecules will greatly reduce Amine heat resistance. Therefore, it is necessary to modify it and use new technology to prepare flame-retardant and high-temperature resistant polyimide composite boards on the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J7/04C09D4/02C09D4/06C09D7/63C09D5/18C08G73/10C08K9/04C08K3/32C08K3/34C08K3/22
CPCC08G73/1057C08G73/106C08G73/1071C08J7/04C08J7/042C08J2379/08C08K3/22C08K3/32C08K3/34C08K9/04C08K9/08C08K2003/221C08K2003/327C08K2201/003C08K2201/011C09D4/06C09D5/18C09D7/63
Inventor 陈亮赵广昊钟华春唐柏青程爱民赵继辉许建军刘晓恒赵继英
Owner 苏州凯姆勒绝缘材料有限公司
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