Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-weight high-strength phenol formaldehyde foam and preparation method thereof

A phenolic foam, high-strength technology, applied in the field of foam plastics, can solve the problems of limited popularization, easy slag removal, high production cost, and achieve the effects of reducing production cost, low foam density, and simple operation.

Inactive Publication Date: 2016-10-12
WUHAN UNIV OF TECH
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, phenolic foam has the disadvantages of being brittle, easy to slag, and easy to crack, and the production cost is high, which seriously limits its further promotion and use.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-weight high-strength phenol formaldehyde foam and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The lightweight high-strength phenolic foam provided in Example 1 includes the following raw materials in parts by weight: 100 parts of high-viscosity phenolic resin, 4 parts of silica sol, 3 parts of pH regulator, 2 parts of potassium silicate, 5 parts of emulsifier, foaming 7 parts of agent, 12 parts of curing agent.

[0028] The preparation method of the light-weight high-strength phenolic foam includes: firstly mixing the high-viscosity phenolic resin and silica sol evenly, then adding a pH regulator to make pH=11, then adding potassium silicate, emulsifier, foaming agent and curing Each time a substance is added, ensure that it is evenly mixed with other substances, especially when adding a curing agent, increase the speed of the agitator, mix at a high stirring speed, and transfer it to the mold for foaming within one minute.

[0029] The high viscosity phenolic resin has a viscosity of 25000-35000mPa·s.

[0030] The curing agent is a mixture of inorganic acid an...

Embodiment 2

[0032] The present invention proposes a light-weight high-strength phenolic foam, which comprises the following raw materials in parts by weight: 100 parts of high-viscosity phenolic resin, 3 parts of pH regulator, 4 parts of silica sol, 2 parts of potassium silicate, 5 parts of emulsifier, foaming agent 7 parts, 12 parts of curing agent;

[0033] The preparation method of the light-weight high-strength phenolic foam includes: first adjusting the pH of the high-viscosity phenolic resin with a pH regulator to make pH=11, and then adding silica sol, potassium silicate, emulsifier, foaming agent, and curing agent in sequence , every time you add a substance, you should ensure that it is evenly mixed with other substances, especially when adding a curing agent, increase the speed of the agitator, mix at a high stirring speed, and transfer it to the mold for foaming within one minute.

[0034] The high viscosity phenolic resin has a viscosity of 25000-35000mPa·s.

[0035] The curi...

Embodiment 3

[0037] The present invention proposes a light-weight high-strength phenolic foam, which comprises the following raw materials in parts by weight: 100 parts of high-viscosity phenolic resin, 3 parts of pH regulator, 4 parts of silica sol, 2 parts of potassium silicate, 5 parts of emulsifier, foaming agent 7 parts, 12 parts of curing agent;

[0038] The preparation method of the light-weight high-strength phenolic foam comprises: first adjusting the pH of the high-viscosity phenolic resin and the pH of the silica sol with a pH regulator to make the pH = 11, then mixing the two evenly, and then adding silicic acid in turn Potassium, emulsifier, foaming agent, curing agent, every time you add a substance, you should ensure that it is evenly mixed with other substances, especially when adding the curing agent, you should increase the speed of the agitator and mix at a high stirring speed. Minutes to be transferred to molds for foaming.

[0039] The high viscosity phenolic resin ha...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Viscosityaaaaaaaaaa
Login to View More

Abstract

The invention provides high-weight high-strength phenol formaldehyde foam and a preparation method thereof. The foam is mainly prepared from the following raw materials in parts by weight: 100 parts of high-viscosity phenolic resin, 4 to 6 parts of silica sol, 3 to 5 parts of pH regulators, 2 to 4 parts of potassium silicate, 7 to 10 parts of foaming agents, 5 to 10 parts of emulsifiers and 10 to 16 parts of curing agents. The preparation method of the foam has the advantages that nanometer silicon dioxide particles are introduced into formaldehyde foam by using silica sol / potassium silicate; Si-O-C chemical bonds are generated by using the effects of nanometer silicon dioxide and high-viscosity phenolic resin; an interface enhancing effect is generated. Concretely, in a container with a stirring function, the raw materials are added according to the proportion ratio; after the materials are uniformly stirred, the materials are fast poured into a mold; foaming is performed at 65 to 70 DEG C; the heat insulation is performed for 20 to 30 min; demoulding is performed. The mechanical intensity is improved; the production cost is reduced; the heat resistance is improved; the operation is simple; the method is suitable for industrialized operation.

Description

technical field [0001] The invention relates to the technical field of foam plastics, in particular to a light-weight high-strength phenolic foam and a preparation method thereof. Background technique [0002] Phenolic resin is a new generation of fireproof thermal insulation material, known as the king of thermal insulation materials, compared with inorganic thermal insulation board thermal conductivity, phenolic thermal insulation board not only has a lower thermal conductivity, but also flame retardant and easy to extinguish, smoke The advantages of small quantity, good thermal stability and light weight make it widely used in construction, transportation, chemical and other fields. However, phenolic foam has the disadvantages of being brittle, easy to drop slag, and easy to crack, and its production cost is high, which seriously limits its further popularization and use. In view of these shortcomings, the invention conducts research on strengthening and modifying the fo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L61/06C08K3/36C08K3/34C08J9/14C08G8/10
CPCC08K3/36C08G8/10C08J9/141C08J9/145C08J9/147C08J2203/14C08J2203/142C08J2203/144C08J2203/182C08J2203/202C08J2361/06C08K3/34C08K2201/011C08L2201/02C08L2201/08C08L2203/14C08L61/06
Inventor 陈艳军樊晓强张超灿黄亮
Owner WUHAN UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com