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Precision waterproof parts with ultra-thin circuit boards and molds and processes for forming the parts

A circuit board, ultra-thin technology, which is applied in precision waterproof parts and molds and processes for forming the parts, can solve the problems of inconvenient use, fixed installation of FPC circuit boards, etc., and achieve low surface tension, good product performance, and durability Good temperature and weather resistance

Active Publication Date: 2021-11-23
DONGGUAN MEMTECH ELECTRONICS MEMTECH ELECTRONICS PRO
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention aims at the shortcomings of the prior art, and its main purpose is to provide a precision waterproof part with an ultra-thin circuit board and a mold and a process for forming the part, which can effectively solve the problem that the existing FPC circuit board cannot The problem of inconvenient use caused by direct fixed installation with the outside

Method used

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  • Precision waterproof parts with ultra-thin circuit boards and molds and processes for forming the parts
  • Precision waterproof parts with ultra-thin circuit boards and molds and processes for forming the parts
  • Precision waterproof parts with ultra-thin circuit boards and molds and processes for forming the parts

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Embodiment Construction

[0045] The invention discloses a mold for forming precision waterproof parts with ultra-thin circuit boards, such as Figure 1 to Figure 6 As shown, it includes an air chamber bottom cover 10, a core plate 20, a middle plate 30, an upper formwork 40 and a binder plate 50, the air chamber bottom cover 10, a core plate 20, a middle plate 30, an upper formwork 40 and The pressing plates 50 are stacked together sequentially from bottom to top.

[0046] A sealed air chamber 201 is formed between the bottom surface of the core plate 20 and the surface of the bottom cover 10 of the air chamber, and at least one core 21 is protruded from the surface of the core plate 20 , and the core 21 extends upward through the middle plate 30 To the bottom surface of the upper template 40, the end surface of the core 21 and the upper template 40 face form a cavity, and the end surface of the core 21 is concavely provided with a positioning cavity 202 for the FPC circuit board 61 and an annular gro...

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Abstract

The invention discloses a precision waterproof part with an ultra-thin circuit board and a mold and process for forming the part. The mold for forming the precision waterproof part with an ultra-thin circuit board includes an air chamber bottom cover, a core board, a middle board, The upper template and the binder plate; the surface of the core board is convexly provided with at least one core, and the upper end surface of the core is concavely provided with a positioning cavity and an annular groove; the precision waterproof part with an ultra-thin circuit board includes an FPC circuit board , plastic support and silica gel layer; by utilizing the mold structure of the present invention and cooperating with the molding process of the present invention, the silica gel layer is formed, and the silica gel layer is used to connect between the FPC circuit board and the plastic support, and the plastic support can be directly installed with the outside, In this way, the FPC circuit board and the external installation can be realized, which brings convenience to the use. With the specific formula of the silica gel layer in the present invention, the silica gel layer can be firmly combined with the FPC circuit board and the plastic bracket, and the insulation, stability, temperature and weather resistance Good, anti-aging, low surface tension, good product performance.

Description

technical field [0001] The invention relates to the technology in the field of moulds, in particular to a precision waterproof component with an ultra-thin circuit board and a mold and process for forming the component. Background technique [0002] FPC circuit board, also known as flexible circuit board, is an ultra-thin circuit board. It is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability. [0003] However, because the thickness of the FPC circuit board is very thin, it cannot be directly connected with an external fixed installation, which brings inconvenience to use. Contents of the invention [0004] In view of this, the present invention aims at the shortcomings of the prior art, and its main purpose is to provide a precision waterproof part with an ultra-thin circuit board and a mold and a proce...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/02H05K5/06
CPCH05K5/0213H05K5/064
Inventor 白毅松
Owner DONGGUAN MEMTECH ELECTRONICS MEMTECH ELECTRONICS PRO
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