Manufacturing method of flexible substrate

Abstract

The invention provides a manufacturing method of a flexible substrate. The method comprises the steps of: 1, providing a rigid substrate, successively generating a first grapheme layer and a second grapheme layer on the surface of the rigid substrate; 2, forming a flexible substrate on the rigid substrate, the first grapheme layer and the second grapheme layer; 3, carrying out cutting along the edges of the flexible substrate; and 4, separating the first t grapheme layer from the second grapheme layer, and obtaining the flexible substrate retaining the second grapheme layer on the bottom surface. Compared with the prior art, the lossless, mild and high-efficiency peeling between the flexible substrate and the rigid substrate is realized, the second grapheme layer retained on the bottom surface of the flexible substrate has no influences on the flexible substrate, the production cost is effectively lowered, and the yield rate of the production process is improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for manufacturing a flexible substrate. Background technique [0002] With the continuous updating and development of science and technology, bendable flexible devices made of flexible substrates are expected to become the mainstream equipment of the next generation of optoelectronic devices, such as displays, chips, circuits, power supplies, sensors and other flexible devices can achieve what traditional optoelectronic devices cannot The functions realized have great advantages in terms of cost and user experience. Taking flexible display as an example, it is a method of preparing devices on the surface of a substrate made of flexible materials, such as flexible active-matrix organic light emitting diodes (Active-matrix organic light emitting diode, AMOLED), which need to be prepared or adsorbed on the surface of a rigid substrate. substrate, followed by device fabric...

AI Technical Summary

Problems solved by technology

[0004] At this stage, many companies and scientific research institutions in the display industry have proposed different solutions for this technology. For example, LG uses a chemical method to etch the stainless steel substrate to achieve the peeling off of the flexible substrate and the rigid substrate. It also has a corrosive effect, which greatly reduces the lifespan of flexible displays

Samsung adopts resistance heating sense detachment technology, which uses heating to detach the substrate from the glass, but the high temperature and the need to protect the light-emitting device, resulting in the yield and cost cannot be guaranteed

However, although the separation of the flexible substrate and the rigid substrate has been achieved, the separation of the flexible substrate and the second rigid substrate will face the same peeling problem, and it is easy to cause damage to the flexible substrate.

Images