Method for dressing polishing pads
A polishing pad and dresser technology, applied in the field of polishing pads, can solve the problems of unsatisfactory polishing pads and non-permanent polishing pad effects, and achieve the effects of increasing removal rate, improving plane parallelism, and improving surface quality
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[0051] As already stated, the method according to the invention can be carried out both with a device for polishing a semiconductor wafer on one side and with a device for polishing a semiconductor wafer on both sides. If an apparatus for double-sided polishing of a semiconductor wafer is used, a dresser 4 can be used instead of the carrier plate used in the polishing process.
[0052] When using a device for double-sided polishing of semiconductor wafers, it is preferred to use an annular or disk-shaped dresser 4 with a peripheral gear ring in tooth mesh with an internal gear 31 and an external gear 32 . The rotational movement of the dresser 4 necessary for multidirectional dressing is ensured by the rotation of the two pinwheels. The side of the dresser 4 facing the upper polishing cloth 12 and the side of the dresser 4 facing the lower polishing cloth 11 are in each case preferably equipped with at least one dressing element 8 .
[0053] In a further embodiment of simult...
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