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A cob welding method and manufacturing method

A manufacturing method and wire bonding technology, applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of prolonged COB manufacturing time, disordered bonding wires, etc., so as to reduce the frequency of replacing the bonding wire process and reduce confusion. The probability of improving the welding efficiency

Active Publication Date: 2018-05-08
HONGLI ZHIHUI GRP CO LTD
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The delay time for each replacement of the welding wire process will prolong the COB manufacturing time; in addition, frequent switching between different welding wires will easily cause welding wire confusion

Method used

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  • A cob welding method and manufacturing method
  • A cob welding method and manufacturing method

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Embodiment Construction

[0030] The present invention will be further described below in conjunction with the accompanying drawings of the description.

[0031] A COB manufacturing method, comprising a solid crystal step and a wire bonding step, comprising the following steps:

[0032] (1) solid crystal; such as figure 1 As shown, a circular crystal-bonding area is provided in the middle of the substrate, and positive electrode pads 2 and negative electrode pads 3 are respectively provided on both sides of the crystal-bonding area; the positive electrode pads and negative electrode pads are arc-shaped, And it is arranged along the edge of the crystal-bonding area; several LED chips 7 are respectively fixed in the two symmetrical half regions of the crystal-bonding area to form two light-emitting units 1, and the LED chips 7 of the two light-emitting units 1 are arranged symmetrically; the light-emitting In unit 1, the LED chips 7 arranged in a line are close to the middle of the die-bonding area, and...

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Abstract

A COB manufacturing method, including a substrate manufacturing step, a solid crystal step, and a wire bonding step, the wire bonding step: (1) among several LED chips arranged in a line, the first wire arc bonding is used between adjacent LED chips connected to form the first series branch; (2) the head and tail between the adjacent first series branches are connected by the second arc welding wire to form the second series branch; (3) in the two rows of LED chips arranged in a staggered manner, the phase Adjacent LED chips are connected by the second wire arc welding wire to form the third series branch; (4) The ends between the second series branch and the third series branch are connected by the second wire arc welding wire to form the fourth series connection (5) The positive and negative poles of the fourth series branch and the pad are connected by the third wire arc welding wire. Since the three wire arc welding wires are welded separately and independently, the frequency of changing the welding wire process of the wire welding machine is reduced, thereby improving the welding efficiency and reducing the probability of confusion.

Description

technical field [0001] The invention relates to COB technology, in particular to a COB welding method and manufacturing method. Background technique [0002] The COB manufacturing process generally includes several steps of solid crystal and wire bonding. The traditional COB wire bonding method is soldered according to the arrangement order of the LED chips. Due to the different arrangement positions and spacing distances of the LED chips, LED chips may need to Different wire bonding processes, in this way, if all LED chips of COB are bonded according to the traditional wire bonding method, the wire bonding machine needs to switch multiple wire bonding processes to complete the wire bonding step. The delay time for each replacement of the welding wire process will prolong the COB manufacturing time; in addition, frequent switching between different welding wires will easily cause welding wire confusion. Contents of the invention [0003] The technical problem to be solved...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H01L33/00H01L33/62
CPCH01L24/85H01L33/005H01L33/62H01L2224/85986H01L2933/0066H01L2224/48137
Inventor 周志勇陈晓彬马思达翁平
Owner HONGLI ZHIHUI GRP CO LTD
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