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Adhesive tape structure and adhesive tape storage body

A technology for adhesive tapes and structures, used in adhesives, film/sheet-like adhesives, layered products, etc. Effect of suppressing manufacturing cost

Active Publication Date: 2018-05-29
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in order to increase the size of the adhesive tape, it is necessary to increase the length of the roll paper (original back) on which the adhesive is applied, or to increase the size of the unwinding / rewinding section of the coating mechanism. In addition, it is necessary to control the coating thickness of the adhesive tape to be uniform, and there is a limit to the large size increase.

Method used

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  • Adhesive tape structure and adhesive tape storage body
  • Adhesive tape structure and adhesive tape storage body
  • Adhesive tape structure and adhesive tape storage body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0105] An adhesive layer and a peeling film were sequentially formed on a connection substrate made of black PET with a thickness of 50 μm to produce a connection tape.

[0106] The pressure-sensitive adhesive layer is composed of the following resin A.

[0107] That is, the composition of the resin A contains 100 parts by weight of a silicon-based resin (SD4584PSA manufactured by Toray Dow Corning Co., Ltd.), 0.7 parts by weight of a curing agent (BY24-741 manufactured by Toray Dow Corning Co., Ltd.), and a silane coupling agent. (A-187 manufactured by Momentive Performance Materials, Inc.) 1 part by weight, platinum catalyst (NC-25 manufactured by Toray Dow Corning Corporation) 0.6 parts by weight.

[0108] This composition was applied to the joint base material with a rod coater, heated at 70°C for 5 minutes, and then heated at 150°C for 4 minutes to harden it to form an adhesive layer with a thickness of 20 μm.

[0109] In addition, as the release film, a release film mad...

Embodiment 2

[0111] As a material of the pressure-sensitive adhesive layer, a connection tape was produced on the same conditions as in Example 1 except that a material composed of the following resin B was used.

[0112] Here, the composition of resin B includes 30 parts by weight of phenoxy resin (YP-50 manufactured by Nippon Steel Chemical Co., Ltd.), 20 parts by weight of liquid epoxy resin (JER828 manufactured by Mitsubishi Chemical Corporation), and rubber component (Nagase Chemtech Co., Ltd. 10 parts by weight of SG80H manufactured by Co., Ltd., 40 parts by weight of hardener (Nobakyua 3941HP manufactured by Asahi Kasei Co., Ltd.), and 1 part by weight of silane coupling agent (A-187 manufactured by Momentive Performance Materials Co., Ltd.).

Embodiment 3

[0114] A connecting tape was produced under the same conditions as in Example 1, except that 5% by weight of a fused silica filler (FB-5D manufactured by Denka Corporation) was added to the above-mentioned resin A.

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Abstract

An object of the present invention is to provide a technology capable of significantly increasing the size of an adhesive tape without changing the conventional roll paper and adhesive application mechanism. The present invention is an adhesive tape structure (1), in which a plurality of adhesive tapes (2) with an adhesive layer (21) and a peeling cover film (22) sequentially provided on a base film (20) are connected via The substrate (30) is sequentially provided with an adhesive layer (31) and a connecting tape (3) of a release film (32) for connection. The aforementioned adhesive tape structure (1) is configured such that the end portion of the base film (20) of the adhesive tape (2) and the end portion of the connecting substrate (30) of the connecting tape (3) are bonded by a substrate-side adhesive member. (41) bonding, and the end of the peeling cover film (22) of the adhesive tape (2) and the end of the peeling film (32) of the connecting tape (3) are bonded by the peeling side adhesive member (42), The release cover film ( 22 ) and the release film ( 32 ) are integrally peeled off.

Description

technical field [0001] The present invention relates to a technique for increasing the size of an adhesive tape for solar cell tab wire bonding or the like. Background technique [0002] Conventionally, long-sized adhesive tapes for bonding various electronic components and the like are known. [0003] Such an adhesive tape is formed on a narrow and long release sheet, and is shipped in the form of a roll wound on a reel. [0004] In addition, at the manufacturing site, the adhesive tape is pulled out from the reel for use, and when the adhesive tape is used up, the production line is temporarily stopped and the adhesive tape is replaced with the reel. [0005] However, if the length of the adhesive tape is short, it is necessary to stop the production line every time the reel is replaced, which reduces the production efficiency. [0006] Therefore, in recent years, so-called "lengthening" which makes the length of the adhesive tape which can be wound up on one reel as lon...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/25B65H21/00
CPCB65H19/1852B65H2301/4127B65H2301/46222B65H2701/1942C09J2203/322C09J7/403C09J2301/302B32B27/08B65H2801/87C09J7/29
Inventor 滨崎和典花渕太郎中原幸一长谷川刚渡边伸荣
Owner DEXERIALS CORP
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