Interposer substrate and manufacture method thereof

Abstract

The invention provides an interposer substrate and a manufacture method thereof. A loading plate with a first line layer is provided, and the first line layer includes multiple first conductive poles; a first insulation layer is formed on the loading plate, and the first conductive poles are exposed; a second line layer is formed on the first conductive poles and electrically connected with the first conductive poles; multiple second conductive poles are formed on the second line layer; a second insulation layer is formed on the first insulation layer and wraps the second line layer and the second conductive poles, and the end surfaces of the second conductive poles are exposed; and the loading plate is removed. The end surfaces of the first conductive poles are of different geometric shapes except circle, and thus, laying can be carried out according to requirements, and the flexibility of design is improved.

Description

technical field [0001] The invention relates to an intermediary substrate, in particular to an intermediary substrate for packaging and stacking structures and its manufacturing method. Background technique [0002] With the evolution of semiconductor packaging technology, semiconductor devices (Semiconductordevice) have developed different packaging types. In order to improve electrical functions and save packaging space, multiple packaging structures are stacked to form a package stack structure (Package on Package, PoP) , this kind of packaging method can take advantage of the heterogeneous integration characteristics of System in Package (SiP for short), and can integrate electronic components with different functions, such as memory, central processing unit, graphics processor, image application processor, etc., through stack design It achieves system integration and is suitable for various thin and light electronic products. [0003] The early package stack structure ...

AI Technical Summary

Problems solved by technology

[0009] However, in the existing manufacturing method of the intermediary substrate 1, the circuit layers between the layers need to form through holes 100 by laser, and then electroplate metal materials to form the conductive pillars 12, so the end faces of the conductive pillars 12 are all circular in shape. , so the conductive pillar 12 can only be designed as a circular shape, resulting in limited product design

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