Package structure and method of fabricating same

A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problem of shortening the service life of fingerprint image sensors and not meeting the expectations of personalization of high-end electronic products, The surface of the sensing area 110 is easy to be damaged, etc., so as to achieve the effect of a wide range of applications

Inactive Publication Date: 2016-06-08
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0007] However, the silicon crystal fingerprint image sensor needs to directly touch the sensing region 110 of the sensing chip 11 with a finger, so that the surface of the sensing region 110 is easily damaged, thus shortening the service life of the existing fingerprint image sensor
[0008] In addition, in response to the trend of personalization of high-end electronic products, the touch area of ​​the screen often needs to have surfaces of different colors due to aesthetic requirements, and the sensing area 110 cannot meet the expectations of personalization of high-end electronic products.

Method used

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  • Package structure and method of fabricating same
  • Package structure and method of fabricating same
  • Package structure and method of fabricating same

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Embodiment Construction

[0050] The implementation of the present invention is described below with specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0051] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the implementation of this creation. There are limited conditions, so it has no technical substantive significance. Any modification of structure, change of proportion...

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Abstract

Provided are a package structure and a method of fabricating the same. A package structure includes: a substrate; an electronic component disposed on the substrate and having a sensing region; a first encapsulant formed on the substrate and encapsulating the electronic component; and a second encapsulant formed on the first encapsulant, wherein the sensing region of the electronic component faces the second encapsulant, the second encapsulant is harder than the first encapsulant, and the first encapsulant encapsulates the sensing region. Therefore, the sensing region can be protected from being touched by a finger, and the electronic component can thus be protected from being damaged.

Description

technical field [0001] The invention relates to a package structure, especially a package structure of a fingerprint sensor. Background technique [0002] With the improvement of living standards, consumers pay more and more attention to privacy. Many high-end electronic products will be equipped with identification systems to increase the security of data in electronic products. Therefore, the development and design of identification systems are also following consumers. Demand has become the direction of electronics industry development. [0003] With the development of the technology industry, the identification system is developing towards the biometric system. In the biometric identification system, it can be broadly divided into two types of biometric identification based on different identification targets: identification of biological characteristics (such as fingerprints, pupils, faces, and voiceprints) and behavioral characteristics (such as signatures and voices)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/29H01L23/31H01L21/56
CPCH01L2224/73265
Inventor 洪良易陈威帆
Owner SILICONWARE PRECISION IND CO LTD
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