Optical sensing-type three-dimensional high-precision contact scanning measurement probe

Abstract

The invention discloses an optical sensing-type three-dimensional high-precision contact scanning measurement probe, which is characterized in that according to a measurement head unit, a cross suspension plate is arranged in the center of a ring seat, each cantilever end of the cross suspension plate is fixedly connected onto the top end of a V-type cantilever reed at a corresponding position, two bottom ends of the V-type cantilever reed are fixedly connected onto the ring seat, and thus a suspension structure of the cross suspension plate in the ring seat is formed; a wedge-shaped block is fixedly arranged on the upper surface of the cross suspension plate and at the center of the cross suspension plate, NPBS is attached to the top surface of the wedge-shaped block, a reflecting layer is coated on the bottom surface of the wedge-shaped block, and a probe with a measurement ball is fixedly connected onto the lower surface of the cross suspension plate and in the center of the cross suspension plate; and according a measurement unit, a laser emits collimation light, the collimation light is projected to the NPBS, and four-quadrant detectors are used for detecting and acquiring displacement amounts in Z-axis, Y-axis and X-axis directions. The optical sensing-type three-dimensional high-precision contact scanning measurement probe has the advantages of high acquired measurement precision, high sensitivity, small measurement force and convenient adjustment.

Description

technical field [0001] The invention relates to the field of micro-nano testing, in particular to a contact scanning three-dimensional probe applied to a nano-coordinate measuring machine, which can sense the three-dimensional topography of the surface of an object. Background technique [0002] In recent years, the rapid development of microelectronics technology has triggered a revolution in microminiaturization, especially the development of processing technology for MEMS devices of microelectromechanical systems. Micro nozzles, micro steps and other MEMS products. The processing accuracy of these micro-devices is in the micro-nano level. To precisely measure these micro-devices, it is necessary to develop special high-precision detection methods and technical means. For this reason, relevant institutions in various countries are committed to the research of CMM with nanometer precision. [0003] The probe part of the CMM is one of the core components of the CMM, and th...

AI Technical Summary

Problems solved by technology

The existing probe needs to integrate two to four high-precision sensors, which has the problems of complex structure, difficult installation and adjustment, and high cost

For example, the strain gauge-based three-dimensional micro-contact sensing probe developed by the University of Eindhoven in the Netherlands is to make the strain gauge, circuit and elastic elements into an overall structure through precipitation, plate making, etching and other processes. The change of displacement and displacement is detected by the strain gauge installed on the sensitive beam, which is small in size, but the detection sensitivity and accuracy of the strain gauge are relatively low, and the measuring head adopts a triangular topology, which makes the decoupling complicated

The electromagnetic micro-contact probe developed by METAS, the Swiss Federal Bureau of Metrology and Inspection, has three degrees of freedom. The detection in each direction is realized by inductance. The force measurement in the three directions is the same. The structure is mainly made of aluminum. , the electromagnetic probe has a large measurement range, high lateral detection sensitivity and small contact force, but its structure is quite complicated, difficult to install and adjust, and it adopts a triangular suspension structure, which makes decoupling complicated

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