MIC sound guiding path structure and mobile terminal

Abstract

The invention provides an MIC sound guiding path structure and a mobile terminal. The MIC sound guiding path structure comprises a MIC device, a shell body, a battery cover and an independent rubber sleeve, wherein the MIC device comprises a working hole; a sound guiding channel is formed in the interior of the shell body, an outlet of the sound guiding channel is communicated with the working hole, and the shell body is in sealed connection with the MIC device; the battery cover is matched and connected with the shell body, and a sound inlet hole is formed in the battery cover; and a sound guiding through hole is formed in the interior of the independent rubber sleeve, a first end of the sound guiding through hole is communicated with the sound inlet hole, the independent rubber sleeve and the battery cover are sealed through extrusion interference, a second end of the sound guiding through hole is communicated with an inlet of the sound guiding channel, and the independent rubber sleeve is in sealed connection with the shell body. The MIC sound guiding path structure improves the sealing reliability of the MIC sound guiding path, and can avoid the problem of desoldering of the MIC device because the MIC device is impacted by the rubber sleeve.

Description

technical field [0001] The present invention relates to the technical field of communications, and more specifically, to a MIC sound guiding path structure and a mobile terminal having the MIC sound guiding path structure. Background technique [0002] At present, most mobile phones all adopt the structure that the battery cover 3' cooperates with the mobile phone casing 2', such as figure 1 As shown, the battery cover 3' is a part that needs to be disassembled repeatedly, so there is inevitably a gap between the MIC hole on the battery cover 3' and the MIC hole on the housing 2', which causes sound leakage problems in the MIC sound guide path , the traditional solution is to add a foam on the battery cover 3' or the mobile phone casing 2', and seal around the MIC hole through the foam, but the foam is easy to damage and fall off. Such as figure 2 As shown, some mobile phones are provided with a cover-type silicone sleeve 4' on the MIC device 1', and one end of the cover-...

AI Technical Summary

Problems solved by technology

[0002] At present, most mobile phones all adopt the structure that the battery cover 3' cooperates with the mobile phone casing 2', such as figure 1 As shown, the battery cover 3' is a part that needs to be disassembled repeatedly, so there is inevitably a gap between the MIC hole on the battery cover 3' and the MIC hole on the housing 2', which causes sound leakage problems in the MIC sound guide path , the traditional solution is to add a foam on the battery cover 3' or the mobile phone shell 2', and seal the MIC hole through the foam, but the foam is easy to damage and fall off

like figure 2 As shown, some mobile phones are provided with a cover-type silicone sleeve 4' on the MIC device 1', and one end of the cover-type silicone sleeve 4' protrudes from the mobile phone shell 2', and is sealed with the battery cover 3' by squeezing and interfering. Method Although the problem of sound leakage from the gap between the battery cover 3' and the shell 2' has been solved, the cover-type silicone cover 4' is in direct contact with the MIC device 1'. When the mobile phone falls, the battery cover 3' will hit the cover-type silicone cover. 4', while the cover-type silicone sleeve 4' will directly transmit the impact force to the MIC components, causing impact damage to the MIC components, resulting in desoldering of the MIC device 1', resulting in the failure of the MIC device 1'

Moreover, there are too many sealing surfaces between the cover-type silicone sleeve 4' and the MIC device 1', and the sealing reliability is low. The cover-type silicone sleeve 4' will be deformed when squeezed, so that the cover-type silicone sleeve 4' is connected to the MIC device 1' There is a gap in the part, which leads to the problem of sound leakage in the MIC sound guide path

Images