Bottom plate combined assembling mechanism for vehicle circuit board outgoing lines

Abstract

The invention relates to a bottom plate combined assembling mechanism for vehicle circuit board outgoing lines. An inclined wedge module can move along the X axis under the guiding of a bracket; one ends of a first outgoing line and a second outgoing line are inserted into an outgoing line clamping module along the Y direction; the inclined wedge module is arranged below the outgoing line clamping module; a roll ball is arranged in the inclined wedge module; the roll ball is initially positioned in a first inclined wedge groove of the inclined wedge module; the outgoing lien clamping module is fixedly connected with a pin; the Y direction of the pin is corresponding to the position of a second inclined wedge groove; the inclined wedge module moves along the X direction under the drive of external force; the roll ball leaves the first inclined wedge groove, and pushes the outgoing line clamping module to move upwardly so as to enable the first outgoing line and the second outgoing line to be tightly clamped; the inclined wedge module continues to move along the X direction; the second inclined wedge groove pushes the pin to move along the Y direction; the pin drives the overall outgoing line clamping module to move towards the Y direction to enable the first outgoing line and the second outgoing line to move to the proper position.

Description

technical field [0001] The invention relates to a combined assembly structure of a bottom plate of a circuit board lead-out line for a vehicle, and belongs to the technical field of installation and fixing of the lead-out line of a circuit board for a vehicle. Background technique [0002] Some of the existing methods for fixing the lead wires of the automotive circuit board use a lead wire bottom plate combination mechanism, wherein the lead wires are in an L-shaped structure. [0003] In production, it is necessary to assemble the upper base plate, the lower base plate, and the lead-out wires together. Figure 6 It shows the schematic diagram of the assembly of the upper base plate and each lead-out line. In the assembly process on the production line, the third lead-out line 6 is connected to the upper base plate 7 after being bent by the equipment. During manual assembly, the first lead-out line 6 needs to be The line 1 and the second lead-out line 2 pass through the upp...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: in the prior art, the lead wires of the vehicle circuit board are fixed, but the gap between the first and second lead wires and the upper base plate is slightly larger during the assembly process, and it is difficult to locate accurately. If it is very accurate, it will cause the bottom plate to be difficult to press in, resulting in low production efficiency and unstable quality

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