Base plate structure, adhering method and peeling method of flexible base plate thereof

Abstract

The invention discloses a base plate structure, an adhering method and peeling method of a flexible base plate thereof. The base plate structure comprises a carrier base plate, a flexible base plate arranged on the carrier base plate, one or more parallelly arranged adhering layers clamped between the carrier base plate and the flexible base plate; the adhering layers comprises magnetic adhering layers with converting adhering strength under the effect of a magnetic field; the sides of the adhering layers contacting with the flexible base plate are equipped with magnetic adhering layers. Because the magnetic adhering layers with converting adhering strength under the effect of the magnetic field are arranged on one side of the flexible base plate in the base plate structure, the flexible base plate can be adhered and peeled in the manufacturing process through the magnetic adhering layers under the effect of the magnetic field; and the carrier base plate and the adhering layers can be recycled.

Description

technical field [0001] The invention relates to the technical field of substrate manufacturing, in particular to a substrate structure and a method for attaching and peeling off a flexible substrate thereof. Background technique [0002] In recent years, flexible display has developed rapidly as a key technology for next-generation display. Flexible display devices use a rollable flexible substrate, which is made of soft materials and is characterized by variable shape, bendability, and light and thin , Easy to carry and so on. [0003] At present, the processing of flexible substrates is difficult, which seriously limits its application development. Generally, flexible substrates are fixed on rigid carrier substrates. However, the attachment process of flexible substrates is relatively complicated, and it is not easy to peel off the finished flexible substrates. At present, there are many ways to fix the flexible substrate to the carrier substrate, which can be roughly div...

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Problems solved by technology

However, the above method has the following defects: 1. The flexible substrate is attached to the carrier substrate with an adhesive. After the device is peeled off, it is not easy to remove the prepared flexible substrate from the carrier substrate or there is glue residue; The raw material of the flexible substrate is coated on the carrier substrate, and the device is peeled off after the device is manufactured. This method makes it difficult to fix the flexible substrate on the carrier substrate, and the method of coating the raw material and the peeling method used are relatively expensive.

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