Substrate structure and attachment method and stripping method of flexible substrate thereof

Abstract

The invention discloses a substrate structure and an attachment method and stripping method of a flexible substrate thereof. The substrate structure comprises a carrier substrate and a flexible substrate and also comprises one or more bonding layers, wherein the flexible substrate is arranged on the carrier substrate, the bonding layers are clamped between the carrier substrate and the flexible substrate and are arranged in parallel, each bonding layer comprises an electric bonding layer used for converting bonding strength under the action of an electric field, and the electric bonding layer is arranged on one side, which is in contact with the flexible substrate, of the bonding layer. Since the electric bonding layer is arranged on one side of the flexible substrate in the substrate structure and used for converting the bonding strength under the action of the electric field, the attachment and the stripping of the flexible substrate during the fabrication process can be achieved by the electric bonding layer only under the action of the electric field, and the carrier substrate and the bonding layers can be recycled.

Description

technical field [0001] The invention relates to the technical field of substrate manufacturing, in particular to a substrate structure and a method for attaching and peeling off a flexible substrate thereof. Background technique [0002] In recent years, flexible display has developed rapidly as a key technology for next-generation display. Flexible display devices use a rollable flexible substrate, which is made of soft materials and is characterized by variable shape, bendability, and light and thin , Easy to carry and so on. [0003] At present, the processing of flexible substrates is difficult, which seriously limits its application development. Generally, flexible substrates are fixed on rigid carrier substrates. However, the attachment process of flexible substrates is relatively complicated, and it is not easy to peel off the finished flexible substrates. At present, there are many ways to fix the flexible substrate to the carrier substrate, which can be roughly div...

AI Technical Summary

Problems solved by technology

However, the above method has the following defects: 1. The flexible substrate is attached to the carrier substrate with an adhesive. After the device is peeled off, it is not easy to remove the prepared flexible substrate from the carrier substrate or there is glue residue; The raw material of the flexible substrate is coated on the carrier substrate, and the device is peeled off after the device is manufactured. This method makes it difficult to fix the flexible substrate on the carrier substrate, and the method of coating the raw material and the peeling method used are relatively expensive.

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