A kind of drilling method of printed circuit board
A technology of printed circuit board and drilling method, which is applied in the directions of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of low precision and large error of the drilling method of printed circuit board, so as to improve the accuracy and reduce the size error. Effect
Active Publication Date: 2018-10-09
CHONGQING FOUNDER HI TECH ELECTRONICS +1
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Problems solved by technology
[0005] Therefore, the technical problem to be solved in the present invention is to overcome the technical defects of large errors and low precision in the drilling method of printed circuit boards in the prior art.
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Embodiment 1
[0059] This embodiment provides a method for drilling a printed circuit board, including the following steps:
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Abstract
The present invention provides a drilling method for a printed circuit board. The method comprises the following steps: detecting the thickness of a printed circuit board; and controlling a drilling depth of a drill bit on the printed circuit board according to the thickness of the printed circuit board. According to the method provided by the present invention, the thickness of the printed circuit board is detected before drilling, and the drilling depth is adjusted according to the actually detected thickness of the printed circuit board, that is, the actual drilling depth of the drill bit is further controlled, so as to avoid errors due to drilling completely according a standard depth value corresponding to a standard thickness value of a printed circuit board in the prior art, thereby improving the precision of drilling.
Description
technical field [0001] The invention relates to the field of circuit boards, in particular to a drilling method for printed circuit boards. Background technique [0002] With the rapid development of electronic information technology, printed circuit boards (referred to as PCB) are developing in the direction of high density, high integration, high speed and high frequency. The mutual conduction between PCB layers can be realized by back drilling technology. Back drilling technology refers to first drilling through holes in the PCB graphics area, and then electroplating the copper layer on the PCB after the first level drilling holes, so that each layer They are all turned on, and then the excess copper layer that does not need to be turned on is removed, and finally the back drilling is formed. [0003] In the prior art, the above-mentioned excess copper layer is generally removed by drilling. During the drilling process, in order to avoid excessive drilling and affect the...
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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047
Inventor 李小晓涂逊马建
Owner CHONGQING FOUNDER HI TECH ELECTRONICS
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