A kind of flexible display substrate and preparation method thereof

A flexible display and flexible substrate technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as gassing, affecting yield, material stability, etc., achieving simple film forming operations and cost savings , the effect of improving yield

Active Publication Date: 2018-03-27
WUHAN TIANMA MICRO ELECTRONICS CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the preparation process of traditional flexible display devices, due to the use of traditional organic binders such as parylene, the stability of the materials will decrease due to the influence of process temperature in the subsequent preparation process of display elements, resulting in gas blowing. , affecting the flatness of the flexible substrate
If the flexible substrate has bubbles, it will cause the film layer of the display element to be uneven, affect the electrical properties of the display element, and then affect the yield

Method used

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  • A kind of flexible display substrate and preparation method thereof
  • A kind of flexible display substrate and preparation method thereof
  • A kind of flexible display substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Such as figure 2 Shown is a schematic cross-sectional view of a flexible display substrate 200 according to Embodiment 1 of the present invention, including a flexible substrate 203;

[0039] set on the first surface of the flexible substrate 203 (ie, as figure 2 display element 204 on the upper surface shown); and

[0040] set on the second surface of the flexible substrate (ie figure 2 The release layer structure 202 on the lower surface shown),

[0041] The release layer structure 202 includes at least one release layer 2021;

[0042] The release layer 2021 is an inorganic material containing intermolecular hydrogen bonds.

[0043] The release layer 2021 of the flexible display substrate provided in this embodiment is an inorganic material containing intermolecular hydrogen bonds. Bubbles are generated due to the influence of temperature during the manufacturing process, which ensures the flatness requirements of the display device during the manufacturing pr...

Embodiment 2

[0082] The difference between the flexible display substrate structure of Embodiment 2 and Embodiment 1 lies in that the structure of the release layer is different.

[0083] Such as Figure 5 Shown is a schematic cross-sectional view of a release layer structure 200' according to Embodiment 2 of the present invention. In the release layer structure 202', release layers 2021' and water blocking layers 2022' are arranged alternately.

[0084] In a modified implementation of Example 2, the release layer structure 202' is a structure in which the release layer 2021' and the water blocking layer 2022' are alternately arranged three times or more.

[0085] Regarding the preparation method of the flexible display substrate in Example 2, the difference from Example 1 is: 1) Forming the release layer structure 202' on the support carrier includes: the release layer 2021' and the water blocking layer 2022' are formed alternately.

[0086] Specifically, the release layer structure 202...

Embodiment 3

[0091] In embodiment 3, the same part as embodiment 2 will not be repeated here, the difference is that the release layer structure is a sandwich structure of "water blocking layer-central layer-release layer", wherein the water blocking layer It is directly combined with the flexible substrate, and the release layer is directly combined with the support carrier; the central layer can be one or more layers, and can be an inorganic material layer or an organic material layer, as long as it is not affected by temperature in the subsequent manufacturing process. and other reasons affect the flatness of the flexible substrate. Of course, the release layer structure may also be a structure in which the above-mentioned sandwich structure is alternately arranged multiple times.

[0092] In yet another embodiment of embodiment 3, the same structure as the first embodiment of embodiment 3 will not be repeated, the difference is that the release layer is not directly combined with the s...

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PUM

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Abstract

The present invention relates to a flexible display substrate, a flexible display substrate structure and the preparation method of the flexible display substrate. The release layer in the flexible display substrate structure employs inorganic material containing an intermolecular hydrogen bonding. When there is provided enough illumination radiation received by the release layer, the intermolecular hydrogen bonding in the material is broken and hydrogen elements are overflowed to cause the crushing of the release layer and the conversion of the release layer to a stripped structure, so that the stripping of the flexible substrate is realized. The release layer is not able to generate bubbles in the subsequent preparing process as a result of the influence of temperature so that the flexible substrate may maintain flat in the overall preparing process of the flexible display device; and the stripping process of the release layer is not able to influence display elements on the flexible substrate and the like. Therefore, the yield of a flexible display device may be greatly improved.

Description

technical field [0001] The invention belongs to the field of flexible display, and in particular relates to a flexible display substrate, a flexible display substrate structure thereof, and a manufacturing method of the flexible display substrate. Background technique [0002] A flexible display device is manufactured by forming several display elements on a flexible substrate. Usually, in the manufacturing process, the flexible substrate needs to be bonded to a rigid substrate with an adhesive to keep the flexible substrate in good condition in the subsequent manufacturing process. flatness. After various subsequent processes are completed, the flexible substrate is separated from the rigid substrate, thereby completing the preparation of the flexible display device. [0003] For example, figure 1 It is a flow chart of manufacturing a traditional flexible display device. First, a rigid substrate S11 is provided. In order to manufacture a flexible display device, an adhesi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12H01L21/77H01L21/78
CPCH01L21/77H01L21/7806H01L27/12
Inventor 王飞
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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