Photonasty resin composition

Abstract

The invention discloses a photonasty resin composition, relating to the negative type photonasty resin composition. The photonasty comprises a first resin of the repeated unit which is expressed by a certain structure, a binder polymer of the second resin (A), a polymer compound (B), a Polyfunctional thiol compound with more than three functions (C), a photopolymerization initiator (D) and a solution (E). The first resin is mixed with the second resin according to a weight ratio of 50:50-90:10, so that the pattern having an excellent reaction and durance is formed under the low temperature curing condition.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, and more specifically, to a photosensitive resin composition capable of forming a pattern excellent in reactivity and durability even under low-temperature curing conditions. Background technique [0002] In the display field, the photosensitive resin composition is used to form various photocurable patterns such as photoresists, insulating films, protective films, black matrices, and columnar spacers. Specifically, the photosensitive resin composition is selectively exposed and developed by a photolithography process to form a desired photocuring pattern, but in this process, in order to improve the yield of the process and improve the physical properties of the application object, it is required to have high Sensitivity photosensitive resin composition. [0003] The patterning of the photosensitive resin composition utilizes a photolithography method, that is, a change in polarity ...

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Problems solved by technology

[0006] Therefore, the curing condition of the photosensitive resin composition is no longer the conventional high-temperature curing, but requires the necessity of low-temperature curing, but the low-temperature curing has the problems of reduced reactivity and reduced durability of the formed pa

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