Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Automatic angle-switching taking and putting machine for chips

A fully automatic pick-and-place machine technology, which is applied to the manufacture of conveyor objects, electrical components, semiconductor/solid-state devices, etc., can solve the problems of chip surface scratches, high labor costs, and low efficiency of manual pick-and-place, etc. Disc quality, reduced labor intensity, and simple structure

Inactive Publication Date: 2016-01-27
ATHLETE AUTOMATION EQUIP SHANGHAI
View PDF3 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is: in the prior art, for the placement of chips that need to be tilted at a certain angle, basically all chips are manually taken out and reinstalled, which is easy to cause scratches on the chip surface, and at the same time, manual picking and placing The efficiency is low, and the labor cost is high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Automatic angle-switching taking and putting machine for chips
  • Automatic angle-switching taking and putting machine for chips
  • Automatic angle-switching taking and putting machine for chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0027] see Figure 1-Figure 5 , a fully automatic pick-and-place chip machine with angle switching, including parallel and reverse full substrate feeding lines and empty substrate feeding lines, with a turntable mechanism between them; the turntable mechanism is located on one side of the full substrate feeding line A main pressing motor 5 is provided, and the main pressing motor 5 can drive the gear ring 11 below it to move up and down; each station on the turntable mechanism is provided with a suction head mechanism 4 for absorbing chips. The suction head mechanism 4 includes a rotating shaft 4c, a suction nozzle 4a, and a blocking member 4b. The blocking member 4b is fixedly connected up and down with the suction nozzle 4a and can rotate along the rotating shaft 4c at the same time. The rotating shaft 4c is opposite to the blocking member 4b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an automatic angle-switching taking and putting machine for chips. The machine includes a full-substrate loading line and an empty-substrate loading line which are in parallel and in a reverse direction. A rotating disk mechanism is arranged between the full-substrate loading line and the empty-substrate loading line. Each station on the rotating disk mechanism is provided with a sorption head mechanism for adsorbing the chips. After the full-substrate reaches the station corresponding to the rotating disk mechanism along a loading direction, a main pressing-down motor presses down. A blocking ring is in contact with a lateral compression face of a blocking member. The compression face is blocked by the blocking ring and forced to rotate a certain angle in the driving of the rotation of the rotating disk mechanism. And then the main pressing-down motor continues pressing down to enable a suction nozzle to suck the chips. Later the main pressing-down motor uplifts. The blocking ring is separated from the blocking member. The blocking member and the suction nozzle are reset due to angles of internal magnetic mechanisms. Meanwhile the chips are sucked away from the substrate, and are rotated by a certain angle. The sucked chips are rotated to the station corresponding to the empty-substrate loading line along with the rotating disk mechanism. After the chips move in place under the effect of an auxiliary pressing-down motor, the suction nozzle releases the chips, and the empty-substrate is packed with the chips.

Description

technical field [0001] The invention relates to a device for loading and unloading chips and switching placement angles. Specifically, it is a chip automatic angle switching pick-and-place machine, which belongs to the technical field of chip assembly. Background technique [0002] As the automatic production of chip assembly becomes more and more mature, more and more chip packaging needs to have a certain placement angle along the direction of the assembly line in order to adapt to the specific conditions of the actual production line. In the prior art, the placement of such chips is basically All the chips are manually taken out and reinstalled, which is likely to cause scratches on the chip surface. At the same time, the efficiency of manual pick-and-place is low. In addition, due to the continuous increase in labor costs in my country in recent years, it is bound to be greatly reduced if manual operations are continued. Increase the human cost of the enterprise. Content...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/683
CPCH01L21/67703H01L21/6838
Inventor 苏浩杰
Owner ATHLETE AUTOMATION EQUIP SHANGHAI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products