Physical system of ultra-thin chip-level atomic clock
A chip atomic clock and physical system technology, which is applied in the field of chip atomic clock physical systems, can solve the problems of restricting the popularization and use of chip-level atomic clocks, high production costs, and responsible structure, and achieve the effect of simple structure, low cost, and elimination of outgassing
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[0030] like Figure 1-4 As shown, this embodiment provides an ultra-thin chip atomic clock physics system, the chip atomic clock physics system is composed of an LCC base 1 and a ceramic cap 5 to form a sealed structure, and other components are arranged in the sealed structure. Vacuum seal welding is used between the LCC base and the ceramic cap, and the specific process is as follows: heat the metal welding consumables to 250°C for 2 hours, and then the ceramic cap and the LCC base of the physical system can be vacuum sealed and welded. The role is to realize the vacuum packaging of the physical system and reduce power consumption.
[0031] In order to simplify the C field structure of the present invention, in this embodiment, two metal traces 6 are arranged symmetrically on the outer wall of the ceramic cap 5, and the two metal traces made on the ceramic cap can be equivalent to two symmetrically placed Helm Holtz coils will generate a constant magnetic field with better ...
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